Global Patent Index - EP 0746688 B1

EP 0746688 B1 20000913 - LOW PROFILE FAN BODY WITH HEAT TRANSFER CHARACTERISTICS

Title (en)

LOW PROFILE FAN BODY WITH HEAT TRANSFER CHARACTERISTICS

Title (de)

PLATTES LÜFTERGEHÄUSE MIT WÄRMELEITENDEN CHARAKTERISTIKEN

Title (fr)

CORPS DE VENTILATEUR PLAT AVEC CARACTERISTIQUES DE TRANSFERT DE CHALEUR

Publication

EP 0746688 B1 20000913 (EN)

Application

EP 93923741 A 19930929

Priority

  • US 9309266 W 19930929
  • US 96565492 A 19921023

Abstract (en)

[origin: US5288203A] An electronic component cooling low profile fan body with favorable heat transfer characteristics is disclosed. A fan, positioned in the body, includes a number of blades circumferentially formed around a central axis. The blades establish an axial blade depth region in reference to the central axis. The low profile fan body includes a frame supporting the fan. In one embodiment of the invention, the heat transfer body includes a pressure differential surface formed around the outer perimeter of the fan blades within a first segment of the axial blade depth region. An interface surface for connection to the electronic component is positioned opposite of the fan frame. A number of heat transfer devices are disposed between the frame and the interface surface, such that the heat transfer devices are positioned within a second segment of the axial blade depth region. In an alternate embodiment of the invention, heat transfer devices are disposed between the frame and the interface surface, without a pressure differential surface, along the entire axial blade depth region. The configuration of the heat transfer devices allows them to function as both a heat transfer surface and a pressure differential surface.

IPC 1-7

F04D 29/58; H05K 7/20

IPC 8 full level

F04D 29/58 (2006.01); H01L 23/467 (2006.01); H05K 7/20 (2006.01)

CPC (source: EP US)

F04D 25/0613 (2013.01 - EP US); F04D 29/526 (2013.01 - EP US); F04D 29/582 (2013.01 - EP US); H01L 23/467 (2013.01 - EP US); H01L 2924/0002 (2013.01 - EP US)

C-Set (source: EP US)

H01L 2924/0002 + H01L 2924/00

Designated contracting state (EPC)

AT DE ES FR GB IE IT NL SE

DOCDB simple family (publication)

US 5288203 A 19940222; AT 196346 T 20000915; CA 2147752 A1 19940511; CA 2147752 C 19981208; DE 69329431 D1 20001019; DE 69329431 T2 20010222; EP 0746688 A1 19961211; EP 0746688 A4 19980513; EP 0746688 B1 20000913; JP 3400801 B2 20030428; JP H08502804 A 19960326; WO 9410451 A1 19940511

DOCDB simple family (application)

US 96565492 A 19921023; AT 93923741 T 19930929; CA 2147752 A 19930929; DE 69329431 T 19930929; EP 93923741 A 19930929; JP 51106394 A 19930929; US 9309266 W 19930929