EP 0749639 A1 19961227 - HIGH-DENSITY ELECTRICAL INTERCONNECT SYSTEM
Title (en)
HIGH-DENSITY ELECTRICAL INTERCONNECT SYSTEM
Title (de)
ELEKTRISCHES VERBINDUNGS SYSTEM VON HOHER DICHTE
Title (fr)
SYSTEME ELECTRIQUE D'INTERCONNEXIONS A HAUTE DENSITE
Publication
Application
Priority
- US 9502679 W 19950309
- US 20921994 A 19940311
Abstract (en)
[origin: WO9524748A1] An electrical interconnect system includes a support element; and an array of groups of multiple electrically conductive contacts arranged on the support element such that at least one contact of each group includes a front surface facing outwardly and away from that group along a line initially intersected by a side surface of a contact from another one of the groups of the array. The groups may be arranged in a configuration such that the array has a density of at least 500, 600, or 1,000 contacts per square inch.
IPC 1-7
IPC 8 full level
H01R 13/04 (2006.01); H01R 12/50 (2011.01); H01R 12/71 (2011.01); H01R 13/26 (2006.01); H01R 24/00 (2006.01); H01R 12/85 (2011.01); H01R 13/193 (2006.01); H01R 24/60 (2011.01)
CPC (source: EP)
H01R 12/718 (2013.01); H01R 12/73 (2013.01); H01R 13/26 (2013.01); H01R 12/721 (2013.01); H01R 12/85 (2013.01); H01R 13/193 (2013.01); H01R 24/60 (2013.01); H01R 2107/00 (2013.01)
Citation (search report)
See references of WO 9524748A1
Designated contracting state (EPC)
DE FR GB IT NL
DOCDB simple family (publication)
WO 9524748 A1 19950914; AU 2093995 A 19950925; DE 69511684 D1 19990930; DE 69511684 T2 19991223; EP 0749639 A1 19961227; EP 0749639 B1 19990825; JP 3323507 B2 20020909; JP H09510317 A 19971014; KR 100346917 B1 20021130; TW 247376 B 19950511
DOCDB simple family (application)
US 9502679 W 19950309; AU 2093995 A 19950309; DE 69511684 T 19950309; EP 95913542 A 19950309; JP 52354695 A 19950309; KR 19960705043 A 19960911; TW 83102272 A 19940316