Global Patent Index - EP 0750791 A1

EP 0750791 A1 19970102 - ELECTRIC CONNECTIONS ARRANGED IN A HIGH-DENSITY GRID

Title (en)

ELECTRIC CONNECTIONS ARRANGED IN A HIGH-DENSITY GRID

Title (de)

ELEKTRISCHE VERBINDUNGEN IN HOCHDICHTER RASTERANORDNUNG

Title (fr)

CONNEXIONS ELECTRIQUES AGENCEES EN GRILLE DE HAUTE DENSITE

Publication

EP 0750791 A1 19970102 (DE)

Application

EP 95913029 A 19950314

Priority

  • DE 9500359 W 19950314
  • DE 4408987 A 19940316

Abstract (en)

[origin: DE19509202A1] Electrically conducting connection between a first and a second boundary surface of a substrate (8) of an electronic switch with several leads (3) electrically insulated from each other is claimed. The novelty is that the leads (3) are arranged in a connecting element having first and second surfaces, so that both surfaces are connected, and the first surface partially coincides with the first boundary surface and the second surface partially coincides with the second boundary surface. Prodn. of the connection is also claimed.

IPC 1-7

H01L 23/498

IPC 8 full level

H05K 1/11 (2006.01); H01L 21/48 (2006.01); H01L 23/538 (2006.01); H05K 3/40 (2006.01)

CPC (source: EP)

H01L 21/486 (2013.01); H01L 23/5384 (2013.01); H05K 3/4038 (2013.01); H01L 2924/0002 (2013.01); H01L 2924/3011 (2013.01); H05K 2201/0187 (2013.01); H05K 2201/1028 (2013.01); H05K 2203/0235 (2013.01); H05K 2203/063 (2013.01)

Citation (search report)

See references of WO 9525346A1

Designated contracting state (EPC)

AT BE CH DE DK ES FR GB GR IE IT LI LU MC NL PT SE

DOCDB simple family (publication)

DE 19509202 A1 19950921; EP 0750791 A1 19970102; JP H09510323 A 19971014; WO 9525346 A1 19950921

DOCDB simple family (application)

DE 19509202 A 19950314; DE 9500359 W 19950314; EP 95913029 A 19950314; JP 52378195 A 19950314