EP 0751164 A4 19980408 - CROSS-LINKING RESIN COMPOSITION
Title (en)
CROSS-LINKING RESIN COMPOSITION
Title (de)
HÄRTBARE HARZZUSAMMENSETZUNG
Title (fr)
COMPOSITION DE RESINE DE RETICULATION
Publication
Application
Priority
- JP 4566494 A 19940316
- JP 4566594 A 19940316
- JP 9500453 W 19950316
Abstract (en)
[origin: EP0751164A1] Disclosed is a crosslinking resin composition comprising: (A) a carboxyl group-containing resin as a main agent, having a number average molecular weight of from 1,000 to 40,000 and an acid value of from 10 to 400 mg KOH/g; (B) a cyclic or chain silicone compound as a curing agent, having a number average molecular weight of from 350 to 8,000 and containing at least two epoxy groups in one molecule thereof, wherein the silicone compound is free of a silanol group, a hydrolyzable silyl group and a vinyl polymer structure, and wherein the silicone compound has a siloxy group-containing skeleton; and (C) a medium. The crosslinking resin composition of the present invention not only exhibits excellent storage stability, but is also capable of providing, upon being crosslinked, a cured resin having excellent gloss, weatherability, acid resistance, solvent resistance, water repellency and stain resistance. Therefore, the crosslinking resin composition can be advantageously used for providing various coating compositions, such as paints, and sealants.
IPC 1-7
IPC 8 full level
C08K 5/3435 (2006.01); C08L 101/08 (2006.01)
CPC (source: EP US)
C08K 5/3435 (2013.01 - EP US); C08L 101/08 (2013.01 - EP US)
C-Set (source: EP US)
Citation (search report)
- [Y] EP 0474103 A1 19920311 - KANEGAFUCHI CHEMICAL IND [JP]
- [Y] EP 0475437 A1 19920318 - DOW CORNING TORAY SILICONE [JP]
- [DA] GB 2247461 A 19920304 - KANSAI PAINT CO LTD [JP]
- [Y] PATENT ABSTRACTS OF JAPAN vol. 9, no. 91 (C - 277) 19 April 1985 (1985-04-19) & DATABASE WPI Week 8505, Derwent World Patents Index; AN 28521
- See references of WO 9525139A1
Designated contracting state (EPC)
DE FR GB
DOCDB simple family (publication)
EP 0751164 A1 19970102; EP 0751164 A4 19980408; EP 0751164 B1 19991201; DE 69513644 D1 20000105; DE 69513644 T2 20000629; US 5773497 A 19980630; WO 9525139 A1 19950921
DOCDB simple family (application)
EP 95912434 A 19950316; DE 69513644 T 19950316; JP 9500453 W 19950316; US 70474896 A 19960916