Global Patent Index - EP 0751564 A3

EP 0751564 A3 19980812 - Ultra-thin noble metal coatings for electronic packaging

Title (en)

Ultra-thin noble metal coatings for electronic packaging

Title (de)

Ultradünne Edelmetallüberzuge für elektronische Verpackung

Title (fr)

Revêtements d'un métal noble ultra-minces pour empaquetage électronique

Publication

EP 0751564 A3 19980812 (EN)

Application

EP 96304524 A 19960618

Priority

US 49447695 A 19950626

Abstract (en)

[origin: EP0751564A2] This problem has been solved by providing an ultra-thin composite of noble metal layers on a nickel surface. The composite ranges from 2.5 to 11 microinches in thickness and includes in succession from nickel, a 0.5 to 3.5 microinches of palladium or gold strike, a 0.5 to 5 microinches thick palladium-nickel alloy layer having 10 to 90 weight percent nickel by weight of the alloy, a 0.5 to 5 microinches thick palladium layer, and a 0 to 1 microinch thick gold layer. The gold layer is being used whenever it is desirable to achieve high speed of solder wetting, relative to the speed of solder wetting of palladium. Viable ultra-thin coatings are most effectively obtained by deposition of the layers in a reel-to-reel metal deposition process. <IMAGE>

IPC 1-7

H01L 23/495

IPC 8 full level

H01L 23/50 (2006.01); C23C 28/02 (2006.01); H01L 23/495 (2006.01)

CPC (source: EP US)

H01L 23/49582 (2013.01 - EP US); H01L 24/32 (2013.01 - EP US); H01L 24/45 (2013.01 - EP US); H01L 24/48 (2013.01 - EP US); H01L 24/73 (2013.01 - EP US); H01L 2224/32245 (2013.01 - EP US); H01L 2224/45124 (2013.01 - EP US); H01L 2224/45144 (2013.01 - EP US); H01L 2224/48091 (2013.01 - EP US); H01L 2224/48247 (2013.01 - EP US); H01L 2224/48464 (2013.01 - EP US); H01L 2224/48664 (2013.01 - EP US); H01L 2224/48764 (2013.01 - EP US); H01L 2224/73265 (2013.01 - EP US); H01L 2224/85464 (2013.01 - EP US); H01L 2924/01012 (2013.01 - EP US); H01L 2924/01013 (2013.01 - EP US); H01L 2924/01014 (2013.01 - EP US); H01L 2924/01028 (2013.01 - EP US); H01L 2924/01029 (2013.01 - EP US); H01L 2924/01046 (2013.01 - EP US); H01L 2924/01078 (2013.01 - EP US); H01L 2924/01079 (2013.01 - EP US); H01L 2924/0132 (2013.01 - EP US); H01L 2924/12042 (2013.01 - EP US); H01L 2924/14 (2013.01 - EP US); H01L 2924/181 (2013.01 - EP US)

C-Set (source: EP US)

  1. H01L 2224/48091 + H01L 2924/00014
  2. H01L 2224/45144 + H01L 2924/00014
  3. H01L 2224/45124 + H01L 2924/00014
  4. H01L 2924/0132 + H01L 2924/01026 + H01L 2924/01028
  5. H01L 2924/0132 + H01L 2924/01028 + H01L 2924/01046
  6. H01L 2224/73265 + H01L 2224/32245 + H01L 2224/48247 + H01L 2924/00012
  7. H01L 2924/3512 + H01L 2924/00
  8. H01L 2224/48664 + H01L 2924/00
  9. H01L 2224/48764 + H01L 2924/00
  10. H01L 2924/12042 + H01L 2924/00
  11. H01L 2924/181 + H01L 2924/00012

Citation (search report)

Designated contracting state (EPC)

DE FR GB

DOCDB simple family (publication)

EP 0751564 A2 19970102; EP 0751564 A3 19980812; CN 1146075 A 19970326; JP 3062086 B2 20000710; JP H0917932 A 19970117; MY 132281 A 20070928; SG 44960 A1 19971219; US 5675177 A 19971007

DOCDB simple family (application)

EP 96304524 A 19960618; CN 96108768 A 19960625; JP 16327196 A 19960624; MY PI9602572 A 19960625; SG 1996010145 A 19960625; US 49447695 A 19950626