EP 0751699 A2 19970102 - Method and device for sealing of a thin film electroluminescent device
Title (en)
Method and device for sealing of a thin film electroluminescent device
Title (de)
Verfahren und Vorrichtung zum Abdichten einer Dünnfilm-Elektrolumineszenzanordnung
Title (fr)
Procédé et dispositif pour l'étanchement d'un dispositif électroluminescent à couche mince
Publication
Application
Priority
US 49506495 A 19950626
Abstract (en)
A method of forming a seal for a thin film electroluminescent device (10) includes using deposition techniques (36) to form an integral thin film encapsulating layer (26; 28). Plasma enhanced chemical vapor deposition is utilized, allowing the formation of the seal to take place at substantially room temperature. A pre-bake (34) is performed at an elevated temperature in an evacuated environment prior to the formation of the thin film encapsulating layer. A silicon nitride film my be used as a single-film encapsulating layer, or may be used with another material (30) in the fabrication of a multi-film encapsulating layer.
IPC 1-7
IPC 8 full level
H05B 33/04 (2006.01); H05B 33/10 (2006.01)
CPC (source: EP)
H05B 33/04 (2013.01); H05B 33/10 (2013.01)
Designated contracting state (EPC)
DE FR GB
DOCDB simple family (publication)
EP 0751699 A2 19970102; EP 0751699 A3 19970507; JP H0917572 A 19970117
DOCDB simple family (application)
EP 96304544 A 19960619; JP 14965596 A 19960612