EP 0752017 A1 19970108 - AUTOCLAVE BONDING OF SPUTTERING TARGET ASSEMBLY
Title (en)
AUTOCLAVE BONDING OF SPUTTERING TARGET ASSEMBLY
Title (de)
VERBINDUNG VON ZERSTÄUBUNGSTARGETS IM AUTOKLAVEN
Title (fr)
COLLAGE EN AUTOCLAVE D'UN ENSEMBLE CIBLE DE PULVERISATION CATHODIQUE
Publication
Application
Priority
US 9501089 W 19950125
Abstract (en)
[origin: WO9623085A1] Fabrication techniques for an integrated sputtering target assembly include pressure assisted bonding of soldered layers of material, in particular, soldering of the target material to its backing plate; pressure assisted curing of structural adhesives used to join a finned cover plate (52) to a backing plate (50) which between them form passages for fluid cooling; and bonding an electrical insulating layer to the back surface of the backing plate. The pressure to assist in bonding is typically applied by an autoclave. The cooling fluid passages disposed between a cover and a finned backing plate can be sealed by using laser welding or electron beam welding rather than closing the cooling passages with structural adhesives.
IPC 1-7
IPC 8 full level
C23C 14/34 (2006.01); H01L 21/203 (2006.01); H01L 21/285 (2006.01)
CPC (source: EP)
C23C 14/3407 (2013.01); H01J 37/3491 (2013.01)
Citation (search report)
See references of WO 9623085A1
Designated contracting state (EPC)
AT BE CH DE ES FR GB GR IE IT LI NL SE
DOCDB simple family (publication)
WO 9623085 A1 19960801; AU 1834795 A 19960814; EP 0752017 A1 19970108; JP 3804974 B2 20060802; JP H10502707 A 19980310; TW 317518 B 19971011
DOCDB simple family (application)
US 9501089 W 19950125; AU 1834795 A 19950125; EP 95910130 A 19950125; JP 52282796 A 19950125; TW 84105089 A 19950522