Global Patent Index - EP 0753028 A1

EP 0753028 A1 19970115 - RADIATION CURABLE MOLDING COMPOSITIONS

Title (en)

RADIATION CURABLE MOLDING COMPOSITIONS

Title (de)

STRAHLENHÄRTBARE FORMMASSEN

Title (fr)

COMPOSITIONS DE MOULAGE CAPABLES DE DURCIR SOUS L'EFFET DE RAYONNEMENTS

Publication

EP 0753028 A1 19970115 (EN)

Application

EP 95938945 A 19951024

Priority

  • US 9513928 W 19951024
  • US 33427694 A 19941104

Abstract (en)

[origin: WO9615179A2] The invention relates to radiation curable compositions for molding both rigid and flexible medical, orthodontic and other articles. The present invention broadly encompasses pourable liquid compositions which are radiation curable to form rigid or flexible articles. Uses of the compositions include medical devices, flexible or rigid prostheses, dental and orthodontic applications, model-making, and even industrial parts. In its broadest aspects, the compositions of the present invention include as the primary component acrylic-functional polyurethane resin(s), diluent monomers to dilute the composition to the desired consistency, photosensitizers, synergistic reducing agents, lubricants, thickeners, reinforcing fillers and pigments, as needed for the particular application. These components are present in suitable proportions so as to achieve the desired results in terms of physical properties (i.e., strength, hardness, etc.).

IPC 1-7

C08L 75/16

IPC 8 full level

A61L 27/00 (2006.01); A61K 6/083 (2006.01); A61K 6/893 (2020.01); C08F 290/00 (2006.01); C08F 290/06 (2006.01); C08F 299/06 (2006.01); C08G 18/32 (2006.01); C08G 18/67 (2006.01); H04R 25/00 (2006.01)

CPC (source: EP US)

A61K 6/893 (2020.01 - EP); C08F 290/067 (2013.01 - EP US); H04R 25/652 (2013.01 - EP US); H04R 25/658 (2013.01 - EP US)

C-Set (source: EP)

A61K 6/893 + C08L 75/16

Citation (search report)

See references of WO 9615179A2

Designated contracting state (EPC)

DE FR GB

DOCDB simple family (publication)

WO 9615179 A2 19960523; WO 9615179 A3 19961010; DE 753028 T1 19970430; EP 0753028 A1 19970115; JP H09504572 A 19970506

DOCDB simple family (application)

US 9513928 W 19951024; DE 95938945 T 19951024; EP 95938945 A 19951024; JP 51608896 A 19951024