Title (en)

CAVITY FILLED METAL ELECTRONIC PACKAGE

Title (de)

METALLGEFÜLLTER HOHLRAUM FÜR ELEKTRONISCHE PACKUNG

Title (fr)

BOITIER ELECTRONIQUE METALLIQUE A CAVITE REMPLIE

Publication

EP 0754350 A4 19981007 (EN)

Application

EP 95913778 A 19950320

Priority

• US 9503468 W 19950320
• US 22320794 A 19940405

Abstract (en)

[origin: WO9527308A1] There is provided an electronic package (70) where the package components (52, 54) define a cavity (56). A semiconductor device (16) and a portion (18) of a leadframe (20) occupy part of the cavity (56). Substantially the remainder of the cavity (56) is filled with a polymer (26) so that an outermost surface (74) of the polymer (26) is coplanar with a surface (76) of one of the package components (54).

IPC 1-7

H01L 23/02; H01L 23/28

IPC 8 full level

H01L 23/28 (2006.01); H01L 21/56 (2006.01); H01L 23/04 (2006.01); H01L 23/24 (2006.01); H01L 23/29 (2006.01)

CPC (source: EP)

H01L 23/04 (2013.01); H01L 23/24 (2013.01); H01L 23/295 (2013.01); H01L 24/32 (2013.01); H01L 24/45 (2013.01); H01L 24/48 (2013.01); H01L 2224/2612 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/45124 (2013.01); H01L 2224/45144 (2013.01); H01L 2224/45147 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/83855 (2013.01); H01L 2924/01006 (2013.01); H01L 2924/01012 (2013.01); H01L 2924/01014 (2013.01); H01L 2924/01029 (2013.01); H01L 2924/01033 (2013.01); H01L 2924/01074 (2013.01); H01L 2924/01079 (2013.01); H01L 2924/01082 (2013.01); H01L 2924/09701 (2013.01); H01L 2924/14 (2013.01); H01L 2924/15747 (2013.01); H01L 2924/16151 (2013.01); H01L 2924/16152 (2013.01); H01L 2924/16195 (2013.01); H01L 2924/16315 (2013.01); H01L 2924/181 (2013.01)

Citation (search report)

• [PX] WO 9409512 A1 19940428 - OLIN CORP [US]
• [XA] EP 0421005 A2 19910410 - OLIN CORP [US]
• [A] US 5134462 A 19920728 - FREYMAN BRUCE J [US], et al
• [A] WO 9220096 A1 19921112 - SENSONOR AS [NO]
• [PXPA] HOFFMAN P ET AL: "DEVELOPMENT OF A HIGH PERFORMANCE TQFP PACKAGE", 1 May 1994, PROCEEDINGS OF THE ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, WASHINGTON, MAY 1 - 4, 1994, NR. CONF. 44, PAGE(S) 57 - 62, INSTITUTE OF ELECTRICAL AND ELECTRONICS ENGINEERS, XP000479146
• See references of WO 9527308A1

Designated contracting state (EPC)

DE GB

DOCDB simple family (publication)

WO 9527308 A1 19951012; AU 2103895 A 19951023; EP 0754350 A1 19970122; EP 0754350 A4 19981007; JP H09511617 A 19971118; TW 358238 B 19990511

DOCDB simple family (application)

US 9503468 W 19950320; AU 2103895 A 19950320; EP 95913778 A 19950320; JP 52572995 A 19950320; TW 84104480 A 19950505