EP 0755573 A1 19970129 - ELECTRONIC COMPONENT AND PROCESS FOR PRODUCING SAME
Title (en)
ELECTRONIC COMPONENT AND PROCESS FOR PRODUCING SAME
Title (de)
ELEKTRONISCHES BAUELEMENT UND VERFAHREN ZU SEINER HERSTELLUNG
Title (fr)
COMPOSANT ELECTRONIQUE ET SON PROCEDE DE FABRICATION
Publication
Application
Priority
- DE 9500511 W 19950413
- DE 4413529 A 19940415
Abstract (en)
[origin: DE4413529A1] An electronic component and a process for producing it are disclosed. The electronic component consists of a chip and a housing. A layer (3) of hot-melt-type adhesive is applied between the lower side (1a) of the chip (1) and the inner side (2a) of the bottom (2) of the housing. In order to produce such a component, a defined amount of hot-melt-type adhesive is applied on the predetermined connection between the chip and the housing, the chip is positioned thereon and pressed down. The thus prefabricated component is cooled and further processed. Once its processing is finished and its housing is closed, the complete component is heated once again, so that the hot-melt-type adhesive softens once again and resolidifies when the component is cooled. Mechanical stresses in the chip or between the chip and the housing are thus reduced.
IPC 1-7
IPC 8 full level
H01L 21/58 (2006.01); H01L 23/552 (2006.01)
CPC (source: EP)
H01L 23/552 (2013.01); H01L 24/29 (2013.01); H01L 24/83 (2013.01); H01L 24/48 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/8319 (2013.01); H01L 2224/8388 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/0102 (2013.01); H01L 2924/07802 (2013.01); H01L 2924/15153 (2013.01); H01L 2924/15165 (2013.01); H01L 2924/3025 (2013.01)
Citation (search report)
See references of WO 9528739A1
Designated contracting state (EPC)
AT BE CH DK FR GB IT LI SE
DOCDB simple family (publication)
DE 4413529 A1 19951019; DE 4413529 C2 19960725; AU 2254195 A 19951110; EP 0755573 A1 19970129; FI 964115 A0 19961014; FI 964115 A 19961213; NO 964367 D0 19961014; NO 964367 L 19961014; WO 9528739 A1 19951026
DOCDB simple family (application)
DE 4413529 A 19940415; AU 2254195 A 19950413; DE 9500511 W 19950413; EP 95915782 A 19950413; FI 964115 A 19961014; NO 964367 A 19961014