EP 0756922 A1 19970205 - Process for molding ceramics
Title (en)
Process for molding ceramics
Title (de)
Verfahren zum Formen von Keramikwerkstoffen
Title (fr)
Procédé de moulage pour matériaux céramiques
Publication
Application
Priority
EP 95111854 A 19950727
Abstract (en)
A wet molding method in which a ceramic slurry is charged into a cavity and uniaxially pressed by a punch to remove excess liquid from a portion of the slurry facing the punch to effect molding, the method being improved by maintaining at least one of the following conditions; (a) the pressing of the slurry is stopped at a time between T and 1.5 T, T being defined as the pressing time necessary to remove sufficient excess liquid from the slurry in the mold to produce a molded mass; or (b) the punch displacement position at a time at which sufficient excess liquid is removed from the slurry in the mold to produce a molded mass is less than 17% of the total mold length. <IMAGE>
IPC 1-7
IPC 8 full level
CPC (source: EP)
B28B 1/261 (2013.01); B28B 1/265 (2013.01); B28B 7/46 (2013.01)
Citation (applicant)
- JP H0242321 B2 19900921
- JP S6070701 A 19850422 - NITTO ELECTRIC IND CO
- JP S633906 A 19880108 - KOBE STEEL LTD
- JP S61297103 A 19861227 - CATALER IND CO
Citation (search report)
- [A] EP 0587160 A1 19940316 - SUMITOMO ELECTRIC INDUSTRIES [JP]
- [A] US 5156856 A 19921020 - IWASAKI HIROYUKI [JP], et al
- [A] GB 790027 A 19580129 - SHENANGO CHINA INC
- [A] GB 1072997 A 19670621 - JASBA KERAMIKFABRIK
- [A] PATENT ABSTRACTS OF JAPAN vol. 18, no. 666 (M - 1724) 15 December 1994 (1994-12-15)
Designated contracting state (EPC)
DE FR GB IT NL SE
DOCDB simple family (publication)
EP 0756922 A1 19970205; EP 0756922 B1 20020515; DE 69526733 D1 20020620; DE 69526733 T2 20021114
DOCDB simple family (application)
EP 95111854 A 19950727; DE 69526733 T 19950727