EP 0766311 A3 19981111 - Semiconductor Chip-on-Chip assembly
Title (en)
Semiconductor Chip-on-Chip assembly
Title (de)
Chip-auf-Chip-Montage
Title (fr)
Assemblage de type puce-sur-puce
Publication
Application
Priority
- JP 25115295 A 19950928
- JP 11613896 A 19960510
Abstract (en)
[origin: EP0766311A2] A microcomputer chip is formed with a CPU core, a peripheral circuit, a built-in ROM, and a built-in RAM. An emulation functional chip is formed with an emulation control circuit for controlling the whole process of emulation. First electrode pads formed on the functional surface of the microcomputer chip are electrically interconnected to second electrode pads formed on the functional surface of the emulation functional chip with connecting bumps interposed therebetween. The microcomputer chip and the emulation functional chip are modularized using an insulating resin with the first electrode pads being connected to the second electrode pads. <IMAGE>
IPC 1-7
IPC 8 full level
H01L 21/60 (2006.01); G06F 11/22 (2006.01); H01L 25/065 (2006.01); H01L 25/07 (2006.01); H01L 25/18 (2006.01)
CPC (source: EP KR US)
H01L 23/52 (2013.01 - KR); H01L 25/0652 (2013.01 - EP US); H01L 25/18 (2013.01 - EP US); H01L 2224/16145 (2013.01 - EP US); H01L 2224/32145 (2013.01 - EP US); H01L 2224/48091 (2013.01 - EP US); H01L 2224/48247 (2013.01 - EP US); H01L 2224/73204 (2013.01 - EP US); H01L 2924/01078 (2013.01 - EP US); H01L 2924/01079 (2013.01 - EP US); H01L 2924/09701 (2013.01 - EP US)
Citation (search report)
- [XA] EP 0486829 A2 19920527 - SEIKO EPSON CORP [JP]
- [A] EP 0208494 A2 19870114 - MATSUSHITA ELECTRIC IND CO LTD [JP]
- [A] US 4527234 A 19850702 - BELLAY JEFFREY D [US]
- [XA] PATENT ABSTRACTS OF JAPAN vol. 014, no. 142 (E - 0904) 16 March 1990 (1990-03-16)
- [A] PATENT ABSTRACTS OF JAPAN vol. 095, no. 009 31 October 1995 (1995-10-31)
- [A] PATENT ABSTRACTS OF JAPAN vol. 017, no. 381 (P - 1574) 16 July 1993 (1993-07-16)
Designated contracting state (EPC)
DE FR GB
DOCDB simple family (publication)
EP 0766311 A2 19970402; EP 0766311 A3 19981111; JP H09152979 A 19970610; KR 970018485 A 19970430; US 5805865 A 19980908
DOCDB simple family (application)
EP 96115479 A 19960926; JP 11613896 A 19960510; KR 19960042467 A 19960925; US 72139096 A 19960926