EP 0767467 A2 19970409 - Low dielectric resin composition
Title (en)
Low dielectric resin composition
Title (de)
Harzmasse mit niedriger Dielektrizitätskonstante
Title (fr)
Composition de résine ayant une constante diélectrique faible
Publication
Application
Priority
JP 24322895 A 19950921
Abstract (en)
A low dielectric resin composition comprising the following components (a) and (b), and the dielectric constant of a coating film formed by this composition being at most 3: (a) a resin having functional groups in its molecule and being soluble in a solvent; and (b) a partially hydrolyzed condensate of alkoxysilanes of the formula R<1>mR<2>nSi(OR<3>)4-m-n, wherein each of R<1> and R<2> which may be the same or different, is a non-hydrolyzable group, R<3> is an alkyl group, and m and n are integers of from 0 to 3 satisfying 0</=m+n</=3.
IPC 1-7
IPC 8 full level
C09D 127/12 (2006.01); C09D 183/04 (2006.01); H01B 3/30 (2006.01); H01B 3/44 (2006.01); H01L 21/316 (2006.01)
CPC (source: EP KR US)
C08L 83/04 (2013.01 - KR); H01B 3/445 (2013.01 - EP US); Y10T 428/3154 (2015.04 - EP US); Y10T 428/31544 (2015.04 - EP US); Y10T 428/31663 (2015.04 - EP US); Y10T 428/31667 (2015.04 - EP US)
Designated contracting state (EPC)
DE FR GB IT
DOCDB simple family (publication)
EP 0767467 A2 19970409; EP 0767467 A3 19980128; EP 0767467 B1 20020116; CN 1122078 C 20030924; CN 1165161 A 19971119; DE 69618521 D1 20020221; DE 69618521 T2 20021031; JP H09143420 A 19970603; KR 100428826 B1 20040918; KR 970015670 A 19970428; SG 74567 A1 20000822; TW 420708 B 20010201; US 5905117 A 19990518
DOCDB simple family (application)
EP 96115073 A 19960919; CN 96122542 A 19960920; DE 69618521 T 19960919; JP 22911796 A 19960829; KR 19960041499 A 19960921; SG 1996010670 A 19960919; TW 85111393 A 19960918; US 71606596 A 19960919