EP 0769346 B1 20020109 - Composite solder paste for flip chip bumping
Title (en)
Composite solder paste for flip chip bumping
Title (de)
Zusammengesetzte Weichlotpaste für Löthöcker für Flip-Chip-Montage
Title (fr)
Pâte de soudure composite pour bosses de soudure pour montage flip-chip
Publication
Application
Priority
US 53659295 A 19950929
Abstract (en)
[origin: EP0769346A1] Composite solder paste compositions adapted to be deposited using a dry film photoresist mask to form solder joints for flip chip integrated circuit devices. The composite solder paste compositions are characterized by the ability to flow at a first temperature during bumping reflow while the photoresist mask is present, yet upon subsequently reheating to a higher temperature yield solder joints capable of withstanding temperatures of 200 DEG C and higher. As such, the present invention retains the advantages associated with using a dry film photoresist as a mask during deposition of the solder, yet results in the formation of solder joints that exhibit enhanced reliability in severe thermal environments.
IPC 1-7
IPC 8 full level
B23K 35/02 (2006.01); B23K 35/14 (2006.01); B23K 35/22 (2006.01); B23K 35/26 (2006.01); H01L 21/60 (2006.01); H01L 23/485 (2006.01); H05K 3/34 (2006.01)
CPC (source: EP US)
B23K 35/025 (2013.01 - EP US); B23K 35/268 (2013.01 - EP US); H01L 24/10 (2013.01 - EP US); H01L 24/13 (2013.01 - EP US); H05K 3/3485 (2020.08 - EP US); H01L 2224/13 (2013.01 - EP US); H01L 2224/13099 (2013.01 - EP US); H01L 2924/01004 (2013.01 - EP US); H01L 2924/01005 (2013.01 - EP US); H01L 2924/01006 (2013.01 - EP US); H01L 2924/01033 (2013.01 - EP US); H01L 2924/01047 (2013.01 - EP US); H01L 2924/01049 (2013.01 - EP US); H01L 2924/01075 (2013.01 - EP US); H01L 2924/01082 (2013.01 - EP US); H01L 2924/014 (2013.01 - EP US); H01L 2924/14 (2013.01 - EP US); H01L 2924/15787 (2013.01 - EP US); H05K 3/3463 (2013.01 - EP US); H05K 2201/0272 (2013.01 - EP US); H05K 2203/043 (2013.01 - EP US); H05K 2203/0568 (2013.01 - EP US); H05K 2203/0769 (2013.01 - EP US)
Designated contracting state (EPC)
DE FR GB
DOCDB simple family (publication)
EP 0769346 A1 19970423; EP 0769346 B1 20020109; DE 69618416 D1 20020214; DE 69618416 T2 20021107; JP 2960017 B2 19991006; JP H09108884 A 19970428; US 5803340 A 19980908
DOCDB simple family (application)
EP 96202374 A 19960826; DE 69618416 T 19960826; JP 25943096 A 19960930; US 53659295 A 19950929