EP 0772229 A2 19970507 - Vertical wafer compact flip chip feeder
Title (en)
Vertical wafer compact flip chip feeder
Title (de)
Kompakter Flip-Chip-Zuführer mit vertikaler Halbleiterscheibe
Title (fr)
Alimentation compacte de puces de type "flip-chip" à partir d'une galette verticale
Publication
Application
Priority
US 55026295 A 19951030
Abstract (en)
A vertical wafer compact flip chip feeder device includes a loading station for providing a loading location where a flip chip wafer having first and second planar surfaces is received such that the first and second planar surfaces are substantially perpendicular to a first plane. The flip chip feeder device further includes a pick-up station for providing a pick-up location where individual flip chips are retrieved from the flip chip wafer. A wafer translating assembly translates the flip chip wafer between the loading and pick-up stations with the first and second planar surfaces of the flip chip wafer remaining substantially perpendicular to the first plane. A chip pick-up assembly retrieves the individual flip chips from the flip chip wafer at the pick-up station and flips the individual flip chips to a flipped position such that first and second planar surfaces of the individual flip chips are substantially parallel with the first plane. <IMAGE>
IPC 1-7
IPC 8 full level
B65G 49/07 (2006.01); H01L 21/00 (2006.01)
CPC (source: EP US)
H01L 21/67144 (2013.01 - EP US); Y10S 414/138 (2013.01 - EP US); Y10S 414/139 (2013.01 - EP US); Y10T 29/49133 (2015.01 - EP US); Y10T 29/49819 (2015.01 - EP US); Y10T 29/49821 (2015.01 - EP US); Y10T 29/49822 (2015.01 - EP US); Y10T 29/53013 (2015.01 - EP US); Y10T 29/53187 (2015.01 - EP US); Y10T 29/53191 (2015.01 - EP US)
Designated contracting state (EPC)
DE FR GB
DOCDB simple family (publication)
EP 0772229 A2 19970507; EP 0772229 A3 19980617; SG 86987 A1 20020319; US 5671530 A 19970930
DOCDB simple family (application)
EP 96202731 A 19960930; SG 1996011003 A 19961029; US 55026295 A 19951030