EP 0774165 B1 19981021 - METHOD OF MANUFACTURING A THREE-DIMENSIONAL CIRCUIT
Title (en)
METHOD OF MANUFACTURING A THREE-DIMENSIONAL CIRCUIT
Title (de)
VERFAHREN ZUR HERSTELLUNG EINER DREIDIMENSIONALEN SCHALTUNGSANORDNUNG
Title (fr)
PROCEDE DE FABRICATION D'UN CIRCUIT TRIDIMENSIONNEL
Publication
Application
Priority
- DE 9500998 W 19950801
- DE 4427515 A 19940803
Abstract (en)
[origin: DE4427515C1] A substrate wafer comprising components (13) is bonded to a support plate (3) and reduced in thickness from the rear side. A photoresist mask is created on the rear face of the substrate plate which is then separated into individual components (13) by an etching process. The photoresist mask is removed and a further component (6), in particular a component stack, is applied to at least one of the individual components (13) and securely attached to the individual component in question (13a).
IPC 1-7
IPC 8 full level
H01L 21/68 (2006.01); H01L 21/78 (2006.01); H01L 21/98 (2006.01); H01L 25/065 (2006.01); H01L 25/07 (2006.01); H01L 25/18 (2006.01); H01L 27/00 (2006.01)
CPC (source: EP US)
H01L 25/0657 (2013.01 - EP US); H01L 25/50 (2013.01 - EP US); H01L 2225/06513 (2013.01 - EP US); H01L 2225/06555 (2013.01 - EP US); H01L 2924/0002 (2013.01 - EP US)
Designated contracting state (EPC)
DE FR GB IT
DOCDB simple family (publication)
DE 4427515 C1 19950824; DE 59504005 D1 19981126; EP 0774165 A1 19970521; EP 0774165 B1 19981021; JP H10503324 A 19980324; US 5943563 A 19990824; WO 9604683 A1 19960215
DOCDB simple family (application)
DE 4427515 A 19940803; DE 59504005 T 19950801; DE 9500998 W 19950801; EP 95926834 A 19950801; JP 52992195 A 19950801; US 77655797 A 19970130