EP 0776985 B1 20011219 - Method for applying a metallic adhesion layers for ceramic insulating layer on metallic articles
Title (en)
Method for applying a metallic adhesion layers for ceramic insulating layer on metallic articles
Title (de)
Verfahren zur Aufbringung einer metallischen Haftschicht für keramische Wärmedämmschichten auf metallische Bauteile
Title (fr)
Procédé de disposition d'une couche métallique d'adhérence pour des couches isolantes sur articles métalliques
Publication
Application
Priority
DE 19545025 A 19951202
Abstract (en)
[origin: EP0776985A1] A method of applying a metallic bonding layer for thermally sprayed ceramic heat insulating layers (6) on metallic components involves (a) applying a binder onto the degreased and oxide-free metallic surface of the substrate material (2); (b) applying metallic bonding powder (4) uniformly onto the binder; (c) applying solder powder (5), of smaller particle size than the bonding powder (4), uniformly onto the binder; and (d) drying the binder and heat treating to effect soldering. In an alternative method, an oxidation and corrosion resistant layer is produced on the cleaned metallic surface by gas-shielded plasma spraying prior to step (a), the bonding powder is a coarse powder having the same composition as this oxidation and corrosion resistant layer, step (c) is omitted and step (d) comprises drying the binder and then heat treating (solution annealing) to form a sintered bond between the metallic component and the oxidation and corrosion resistant layer and between the oxidation and corrosion resistant layer and the bonding powder. Also claimed are metallic bonding layers produced by the above methods.
IPC 1-7
IPC 8 full level
C23C 24/10 (2006.01); C23C 4/02 (2006.01); C23C 4/18 (2006.01); C23C 24/08 (2006.01); C23C 26/00 (2006.01); C23C 28/00 (2006.01)
CPC (source: EP US)
C23C 4/02 (2013.01 - EP US); C23C 28/00 (2013.01 - EP US); Y10T 428/12028 (2015.01 - EP US); Y10T 428/12056 (2015.01 - EP US); Y10T 428/12063 (2015.01 - EP US); Y10T 428/12097 (2015.01 - EP US)
Designated contracting state (EPC)
AT BE CH DE FR GB IT LI NL SE
DOCDB simple family (publication)
EP 0776985 A1 19970604; EP 0776985 B1 20011219; AT E211185 T1 20020115; CA 2188614 A1 19970603; CA 2188614 C 20051004; CN 1160088 A 19970924; CN 1161489 C 20040811; CZ 290920 B6 20021113; CZ 346896 A3 19970813; DE 19545025 A1 19970605; DE 59608498 D1 20020131; JP 3983323 B2 20070926; JP H09176818 A 19970708; PL 181404 B1 20010731; PL 182552 B1 20020131; PL 317298 A1 19970609; RU 2209256 C2 20030727; UA 42001 C2 20011015; US 5894053 A 19990413
DOCDB simple family (application)
EP 96810768 A 19961111; AT 96810768 T 19961111; CA 2188614 A 19961023; CN 96123909 A 19961202; CZ 346896 A 19961126; DE 19545025 A 19951202; DE 59608498 T 19961111; JP 33444496 A 19961202; PL 31729896 A 19961202; PL 34435196 A 19961202; RU 96122818 A 19961129; UA 96114470 A 19961129; US 74393696 A 19961105