EP 0784539 A1 19970723 - THERMAL MANAGEMENT FOR ADDITIVE PRINTED CIRCUITS
Title (en)
THERMAL MANAGEMENT FOR ADDITIVE PRINTED CIRCUITS
Title (de)
THERMISCHE KONTROLLE FÜR MIT ADDITIVEN BEDRUCKTE SCHALTUNGEN
Title (fr)
GESTION THERMIQUE POUR CIRCUITS IMPRIMES ADDITIFS
Publication
Application
Priority
- US 9512990 W 19951003
- US 31841294 A 19941005
Abstract (en)
[origin: WO9611105A1] A heat dissipating assembly for mounting heat generating electronic components is described. The invention comprises a thermally conductive fiber reinforced polymeric resin sheet containing thermally conductive fillers and having planar surfaces, an additive printed circuit board and a metal heat sink having at least one planar surface. Because the dielectric surfaces and conductors of additive printed circuit boards are coplanar, intimate contact between the planar surfaces of the thermally conductive resin sheet, the printed circuit board surface and the metal heat sink is maintained without intermediate voids, thereby significantly enhancing heat transfer from the printed circuit board to the metal heat sink.
IPC 1-7
IPC 8 full level
H05K 1/02 (2006.01); H05K 1/05 (2006.01); H05K 3/00 (2006.01); H05K 7/20 (2006.01); H05K 3/18 (2006.01)
CPC (source: EP)
H05K 1/056 (2013.01); H05K 3/0061 (2013.01); H05K 7/20509 (2013.01); H05K 3/184 (2013.01); H05K 2201/0209 (2013.01)
Designated contracting state (EPC)
DE FR GB
DOCDB simple family (publication)
WO 9611105 A1 19960418; EP 0784539 A1 19970723; EP 0784539 A4 19990120; JP H10509277 A 19980908
DOCDB simple family (application)
US 9512990 W 19951003; EP 95937408 A 19951003; JP 51268496 A 19951003