EP 0785296 B1 20000315 - Electroplating of nickel on nickel ferrite devices
Title (en)
Electroplating of nickel on nickel ferrite devices
Title (de)
Elektroplattieren von Nickel auf Nickel-Ferrit Vorrichtungen
Title (fr)
Dépôt électrolytique de nickel sur des dispositifs en nickel ferrite
Publication
Application
Priority
- US 58107995 A 19951229
- US 76918996 A 19961218
Abstract (en)
[origin: EP0785296A1] This invention is predicated on the discovery by the present applicants that boric acid in conventional nickel plating baths is responsible for excessive lateral growth in the electroplating of nickel on nickel ferrite substrates. While nickel baths without boric acid do not yield acceptable electrodeposits, the boric acid interacts with the ferrite substrate to cause excessive lateral growth. Applicants further discovered that by eliminating the boric acid and adding another acidic plating buffer such as citric acid, one can obtain isotropic nickel plating and produce a wire-bondable surface.
IPC 1-7
IPC 8 full level
C25D 3/12 (2006.01); C25D 5/18 (2006.01); C25D 5/26 (2006.01)
CPC (source: EP)
C25D 3/12 (2013.01)
Designated contracting state (EPC)
DE FR GB
DOCDB simple family (publication)
EP 0785296 A1 19970723; EP 0785296 B1 20000315; DE 69607130 D1 20000420; DE 69607130 T2 20001019; JP H09310194 A 19971202; MX 9700180 A 19971231
DOCDB simple family (application)
EP 96309396 A 19961223; DE 69607130 T 19961223; JP 3897 A 19970106; MX 9700180 A 19970107