Global Patent Index - EP 0785590 A1

EP 0785590 A1 19970723 - Composite high-frequency component

Title (en)

Composite high-frequency component

Title (de)

Zusammengestellte Hochfrequenzkomponente

Title (fr)

Elément composite à hautes fréquences

Publication

EP 0785590 A1 19970723 (EN)

Application

EP 97100647 A 19970116

Priority

JP 486496 A 19960116

Abstract (en)

A composite high-frequency component (10) is designed to occupy only a smaller area and a smaller volume when mounted in an apparatus, to be disposed with improved flexibility, and to be able to operate without an impedance matching circuit. The composite high-frequency component (10) includes a multilayer substrate (11), diodes constituting a high-frequency switch component (1), and a circuit base (12). External terminals for connection to a transmitting circuit, a receiving circuit and an antenna, external terminals for control and an external terminal for connection to ground potential are formed on an outer surface of the multilayer substrate (11). Strip lines and capacitors constituting the high-frequency switch (1) and strip lines and capacitors constituting a low-pass filter circuit (2) are formed in the multilayer substrate (11). <IMAGE>

IPC 1-7

H01P 1/15; H01P 1/203

IPC 8 full level

H01F 27/00 (2006.01); H01P 1/15 (2006.01); H01P 1/203 (2006.01); H03H 7/01 (2006.01); H04B 1/44 (2006.01)

CPC (source: EP KR)

H01P 1/15 (2013.01 - EP); H01P 1/2039 (2013.01 - EP); H01Q 13/26 (2013.01 - KR)

Citation (applicant)

Citation (search report)

  • [A] EP 0468801 A2 19920129 - NGK INSULATORS LTD [JP]
  • [A] GB 2289574 A 19951122 - MURATA MANUFACTURING CO [JP]
  • [A] H MANDAI ET AL.: "Advanced multi-layer ceramic surface-mount functional components for telecommunications equipment", 45TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE, 21 May 1995 (1995-05-21) - 24 May 1995 (1995-05-24), LAS VEGAS (US), pages 247 - 250, XP002029547
  • [A] Y. TAGUCHI ET AL.: "Microwave characteristics of alumina-glass composite multi-layer substrates with co-fired copper conductors", IEICE TRANSACTIONS ON ELECTRONICS, vol. E76c, no. 6, June 1993 (1993-06-01), TOKYO JP, pages 912 - 918, XP000389645

Designated contracting state (EPC)

DE FI FR GB SE

DOCDB simple family (publication)

EP 0785590 A1 19970723; CN 1060884 C 20010117; CN 1167367 A 19971210; JP H09200077 A 19970731; KR 100261751 B1 20000715; KR 970060575 A 19970812

DOCDB simple family (application)

EP 97100647 A 19970116; CN 97102290 A 19970116; JP 486496 A 19960116; KR 19970001108 A 19970116