Global Patent Index - EP 0787162 A2

EP 0787162 A2 19970806 - CURABLE EPOXY RESIN ACCELERATED BY BORIC ACID AND ITS ANALOGS

Title (en)

CURABLE EPOXY RESIN ACCELERATED BY BORIC ACID AND ITS ANALOGS

Title (de)

Härtbare Epoxyharz enthaldend Borsaüre und ihre Analoge wie Hartungsbeschleuniger

Title (fr)

RESINE EPOXY DURCISSABLE ACCELEREE PAR L'ACIDE BORIQUE ET SES ANALOGUES

Publication

EP 0787162 A2 19970806 (EN)

Application

EP 95937501 A 19951013

Priority

  • GB 9421407 A 19941021
  • US 9513360 W 19951013

Abstract (en)

[origin: WO9612752A2] Compositions that contain epoxy resin, curing agent and catalyst cure more rapidly if they contain a stoichiometric excess of boric acid compound over the catalyst. Epoxy resins are cured in the presence of at least 1 phr boric acid compound and in the presence of 0 to less than 0.6 moles of catalyst per mole of boric acid compound.

IPC 1-7

C08G 59/68; C08K 3/38

IPC 8 full level

C08J 5/24 (2006.01); B32B 27/38 (2006.01); C08G 59/40 (2006.01); C08G 59/68 (2006.01); C08K 3/38 (2006.01); C08K 5/00 (2006.01); C09J 163/00 (2006.01); H01L 23/14 (2006.01); H01L 23/29 (2006.01); H01L 23/498 (2006.01); C08K 5/19 (2006.01); C08K 5/55 (2006.01); H05K 1/03 (2006.01)

CPC (source: EP KR)

C08G 59/4021 (2013.01 - EP); C08G 59/68 (2013.01 - EP KR); C08K 3/38 (2013.01 - EP KR); C08K 5/0025 (2013.01 - EP); C09J 163/00 (2013.01 - EP); H01L 23/145 (2013.01 - EP); H01L 23/293 (2013.01 - EP); H01L 23/49894 (2013.01 - EP); C08K 5/19 (2013.01 - EP); C08K 5/55 (2013.01 - EP); H01L 2924/0002 (2013.01 - EP); H05K 1/0326 (2013.01 - EP)

C-Set (source: EP)

  1. C08K 3/38 + C08L 63/00
  2. C08K 5/0025 + C08L 63/00
  3. H01L 2924/0002 + H01L 2924/00

Citation (search report)

See references of WO 9612752A2

Designated contracting state (EPC)

AT DE FR GB IT SE

DOCDB simple family (publication)

WO 9612752 A2 19960502; WO 9612752 A3 19960718; BR 9509395 A 19970930; EP 0787162 A2 19970806; GB 9421407 D0 19941207; JP H10507481 A 19980721; KR 970707199 A 19971201; TW 294700 B 19970101

DOCDB simple family (application)

US 9513360 W 19951013; BR 9509395 A 19951013; EP 95937501 A 19951013; GB 9421407 A 19941021; JP 51351996 A 19951013; KR 19970702607 A 19970421; TW 84111048 A 19951019