Global Patent Index - EP 0787358 B1

EP 0787358 B1 20010117 - OPTOCOMPONENT CAPSULE HAVING AN OPTICAL INTERFACE

Title (en)

OPTOCOMPONENT CAPSULE HAVING AN OPTICAL INTERFACE

Title (de)

KAPSEL FÜR EIN OPTOELEKTRISCHES BAUELEMENT MIT EINER OPTISCHEN SCHNITTSTELLE

Title (fr)

CAPSULE POUR OPTOCOMPOSANT A INTERFACE OPTIQUE

Publication

EP 0787358 B1 20010117 (EN)

Application

EP 95936160 A 19951019

Priority

  • SE 9501233 W 19951019
  • SE 9403574 A 19941019

Abstract (en)

[origin: WO9613069A1] In encapsulating an optocomponent with a plastics material an MT-connector compatible interface is obtained having bores (107) for guide pins in the wall of the capsule and optical connection surfaces (110). These bores (107) are obtained from mould cavity guide pins which are used for aligning the optocomponent in a mould cavity in a mould in the moulding operation of the encapsulating material on top of the component. In order to achieve a good accuracy in the positioning of the component during the moulding operation the mould guide pins are as short as possible and end directly behind the component where they are supported by projections extending from each mould half. Thus cavities (109) are created extending straight through the capsule (105) behind the component. The cavities (109) allow that the guide pin bores (107) are cleansed and that material residues are removed after the moulding operation. Further, the cavities (109) can be used for spring clamps which are used for retaining the optocomponent capsule (105) at an optical connector having a similar interface. The clamps can then have tongues which are inserted in the cavities (109) and which, in addition, can be provided with holes, through which the guide pins can be pushed to safe-guard the clamp against being lost.

IPC 1-7

H01L 31/02; G02B 6/00; B29C 33/10

IPC 8 full level

B29C 33/00 (2006.01); B29C 45/14 (2006.01); G02B 6/42 (2006.01); H01L 31/0203 (2006.01); H01L 31/0232 (2006.01); H01L 33/00 (2006.01)

CPC (source: EP US)

B29C 33/0033 (2013.01 - EP US); B29C 45/14065 (2013.01 - EP US); G02B 6/4201 (2013.01 - EP US); G02B 6/4249 (2013.01 - EP US); G02B 6/4255 (2013.01 - EP US); H01L 31/0203 (2013.01 - EP US)

Designated contracting state (EPC)

DE ES FR GB IT NL SE

DOCDB simple family (publication)

WO 9613069 A1 19960502; AU 3820095 A 19960515; CA 2203112 A1 19960502; CA 2203112 C 20050419; CN 1107982 C 20030507; CN 1170475 A 19980114; DE 69519938 D1 20010222; DE 69519938 T2 20010517; EP 0787358 A1 19970806; EP 0787358 B1 20010117; ES 2153500 T3 20010301; FI 971656 A0 19970418; FI 971656 A 19970619; HK 1007904 A1 19990430; JP H10507848 A 19980728; KR 100272031 B1 20001115; SE 9403574 D0 19941019; SE 9403574 L 19960420; US 5985185 A 19991116

DOCDB simple family (application)

SE 9501233 W 19951019; AU 3820095 A 19951019; CA 2203112 A 19951019; CN 95196848 A 19951019; DE 69519938 T 19951019; EP 95936160 A 19951019; ES 95936160 T 19951019; FI 971656 A 19970418; HK 98109027 A 19980708; JP 51383095 A 19951019; KR 19970702589 A 19970419; SE 9403574 A 19941019; US 81742297 A 19970714