Global Patent Index - EP 0796500 B1

EP 0796500 B1 20010912 - PROCESS AND DEVICE FOR MAKING A CONTACT

Title (en)

PROCESS AND DEVICE FOR MAKING A CONTACT

Title (de)

VERFAHREN UND VORRICHTUNG ZUR HERSTELLUNG EINES KONTAKTSTÜCKES

Title (fr)

PROCEDE ET DISPOSITIF DE FABRICATION D'UNE PIECE DE CONTACT

Publication

EP 0796500 B1 20010912 (DE)

Application

EP 96933439 A 19961002

Priority

  • DE 19537657 A 19951010
  • EP 9604294 W 19961002

Abstract (en)

[origin: DE19537657A1] The description relates to a process for making a contact with a basic body of good electrically conductive material (first material) and a contact layer of less electrically conductive material (second material) which is resistant to arc burning, in which the contact layer has a sintered structure soaked with the material of the basic body. The basic body and the sintered structure are applied one on the other in a cup-like mould, heated therein to above the melting point of the first material but still below that of the second, so that the first material melts and penetrates the sintered structure. Here the sintered structure can be produced by scattering the second material in powder form on the first and first sintering in a degassing process below the melting point of the first material. It is also possible to produce the sintered structure beforehand and lay a green compact on the basic body.

IPC 1-7

H01H 1/02

IPC 8 full level

B22F 7/08 (2006.01); H01H 1/02 (2006.01); H01H 1/04 (2006.01); H01H 11/04 (2006.01)

CPC (source: EP US)

H01H 1/0206 (2013.01 - EP US)

Designated contracting state (EPC)

DE FR GB

DOCDB simple family (publication)

DE 19537657 A1 19970417; CN 1070635 C 20010905; CN 1166231 A 19971126; DE 59607681 D1 20011018; EP 0796500 A1 19970924; EP 0796500 B1 20010912; JP 3652706 B2 20050525; JP H11501766 A 19990209; US 6010659 A 20000104; WO 9714163 A1 19970417

DOCDB simple family (application)

DE 19537657 A 19951010; CN 96191198 A 19961002; DE 59607681 T 19961002; EP 9604294 W 19961002; EP 96933439 A 19961002; JP 51468397 A 19961002; US 87221997 A 19970610