EP 0798078 A2 19971001 - Method for manufacturing backing pad and apparatus used therefor
Title (en)
Method for manufacturing backing pad and apparatus used therefor
Title (de)
Verfahren und Vorrichtung zum Herstellen von Stützunterlagen
Title (fr)
Procédé et dispositif pour la fabrication de patins d'appui
Publication
Application
Priority
JP 10437196 A 19960328
Abstract (en)
A method and an apparatus for manufacturing a grooved backing pad suitable for use in polishing of semiconductor wafer based on the waxless method. The backing pad manufacturing apparatus contains a load/unload conveyer 11 and a groove forming unit 21 above a chuck table 4. The main body 22 of the groove forming unit comprises an aluminium-made hollow axis 26 and a plurality of aluminium-made round flanges arrayed thereon. These round flanges having an almost equal diameter are aligned concentrically with the hollow axis and fixed thereon along its longitudinal direction. In a fabrication process of the grooved backing pad, a work fixed on a sheeted elastic member is vacuum-chucked on the chuck table using the load/unload conveyer, steam is supplied through the hollow axis 26 to heat the round flanges 27 to the softening point of the sheeted elastic member or above, and the round flanges are roll-contacted to the surface of the sheeted elastic member under pressure by traveling the main body 22 of the groove forming unit along the surface of the member. <IMAGE>
IPC 1-7
IPC 8 full level
B24B 37/04 (2012.01); B24B 37/30 (2012.01); B24D 7/00 (2006.01); B24D 11/02 (2006.01); B24D 13/14 (2006.01); B24D 18/00 (2006.01); H01L 21/304 (2006.01)
CPC (source: EP)
B24B 37/26 (2013.01); B24D 11/02 (2013.01); B24D 18/00 (2013.01)
Designated contracting state (EPC)
DE FR GB
DOCDB simple family (publication)
EP 0798078 A2 19971001; EP 0798078 A3 19980408; JP H09262763 A 19971007; TW 348280 B 19981221
DOCDB simple family (application)
EP 97302066 A 19970326; JP 10437196 A 19960328; TW 86114144 A 19970927