EP 0798079 A3 19980325 - Polishing apparatus and polishing method for silicon wafers
Title (en)
Polishing apparatus and polishing method for silicon wafers
Title (de)
Vorrichtung und Verfahren zum Polieren von Halbleiterscheiben
Title (fr)
Machine et procédé de polissage de plaquettes semi-conductrices
Publication
Application
Priority
- JP 6799796 A 19960325
- JP 5450497 A 19970310
Abstract (en)
[origin: EP0798079A2] A polishing apparatus and a polishing method of semiconductor wafers are provided, whereby heavy metal contamination of semiconductor wafers can be prevented effectively in a polishing process. A polishing apparatus of semiconductor wafers including a turn table assembly having a rotatably fixed turn table and a polishing slurry tank for storing polishing slurry to be supplied onto the turn table with a polishing slurry supplying member, wherein the polishing slurry supplying member is provided with means for eliminating heavy metal ions from the polishing slurry. <IMAGE>
IPC 1-7
IPC 8 full level
B24B 57/00 (2006.01); B24B 55/03 (2006.01); B24B 57/02 (2006.01); H01L 21/304 (2006.01)
CPC (source: EP)
B24B 37/04 (2013.01); B24B 55/03 (2013.01)
Citation (search report)
- [Y] US 5087372 A 19920211 - TOYOMOTO KAZUO [JP], et al
- [A] EP 0639534 A2 19950222 - EBARA CORP [JP]
- [Y] PATENT ABSTRACTS OF JAPAN vol. 017, no. 102 (C - 1031) 2 March 1993 (1993-03-02)
- [A] PATENT ABSTRACTS OF JAPAN vol. 009, no. 045 (C - 268) 26 February 1985 (1985-02-26)
Designated contracting state (EPC)
DE FR GB
DOCDB simple family (publication)
EP 0798079 A2 19971001; EP 0798079 A3 19980325; EP 0798079 B1 20001018; DE 69703312 D1 20001123; DE 69703312 T2 20010222; JP 3384530 B2 20030310; JP H09314466 A 19971209; MY 132494 A 20071031
DOCDB simple family (application)
EP 97104697 A 19970319; DE 69703312 T 19970319; JP 5450497 A 19970310; MY PI19971183 A 19970320