EP 0801443 A1 19971015 - Noise-damping arrangement for damping noise currents of electronic devices
Title (en)
Noise-damping arrangement for damping noise currents of electronic devices
Title (de)
Dämpfungseinrichtung gegen Störströme elektronischer Komponenten
Title (fr)
Dispositif d'atténuation des courants parasitaires de composants électroniques
Publication
Application
Priority
DE 19614507 A 19960412
Abstract (en)
The HF interference current suppression device uses an inductance through which the operating current is passed, provided by an annular core (7) of an amorphous or nano-crystalline material with a relative permeability of above 20000. The core is fitted over a pin (4) within a plug connector housing (1). A capacitor can be connected between the operating current lead and earth, with the annular core insulated relative to the pin and connected to earth, so that it acts as a capacitor electrode.
Abstract (de)
Zur Verminderung von insbesondere hochfrequenten Störspannungen werden amorphe oder nanokristalline Ringbandkerne (7) auf Stifte (4) innerhalb des Gehäuses (1) einer Steckverbindung aufgebracht. Hierdurch läßt sich die elektromagnetische Verträglichkeit von elektronischen Komponenten in einem weiten Frequenzbereich verbessern. <IMAGE>
IPC 1-7
IPC 8 full level
H01F 1/16 (2006.01); H01F 17/06 (2006.01); H01F 27/00 (2006.01); H01G 4/40 (2006.01); H01R 13/719 (2006.01)
CPC (source: EP)
H01R 13/719 (2013.01)
Citation (search report)
- [Y] DE 3526047 A1 19870122 - VACUUMSCHMELZE GMBH [DE]
- [Y] US 3879691 A 19750422 - FRITZ WILLIAM BAIRD
- [A] EP 0070683 A2 19830126 - AUTOMATION IND INC [US]
- [DA] EP 0299498 A1 19890118 - HITACHI METALS LTD [JP]
- [A] BOLI R.: "WEICHMAGNETISCHE WERKSTOFFE.EINFÜRUNG IN DEN MAGNETISMUS. VAC-WERKSTOFFE UND IHRE ANWENDUNGEN.", 1990, VACUUMSCHMELZE GMBH, HANAU, XP002035600, 220700
Designated contracting state (EPC)
DE FR GB IT
DOCDB simple family (publication)
EP 0801443 A1 19971015; EP 0801443 B1 20030219; DE 59709325 D1 20030327; JP H1064628 A 19980306
DOCDB simple family (application)
EP 97105377 A 19970401; DE 59709325 T 19970401; JP 10388997 A 19970407