EP 0804865 A1 19971105 - PRODUCTION OF ELECTRICAL CIRCUIT BOARDS
Title (en)
PRODUCTION OF ELECTRICAL CIRCUIT BOARDS
Title (de)
HERSTELLUNG ELEKTRISCHER LEITERPLATTEN
Title (fr)
FABRICATION DE PLAQUETTES DE CIRCUITS ELECTRIQUES
Publication
Application
Priority
- GB 9600105 W 19960118
- GB 9501069 A 19950118
- GB 9504879 A 19950310
Abstract (en)
[origin: WO9622670A1] A method of forming a conductive path (11) of an electrical circuit board (1) comprises applying an adhesive (7) to a substrate (3) and applying a conductive ink (25) over the adhesive (7) in a pattern corresponding to the desired conductive path (11). A photoimageable layer (9) can be applied over the adhesive (7) or substrate and subjected to a photoimaging and developing process. This forms a track (13) in the photoimageable layer (9), corresponding to the desired conductive path (11). The conductive ink (25) is introduced into the track (13) prior to heating. The heating affects curing of the adhesive (7) and bonding of the conductive ink (25) to the adhesive layer (7) simultaneously with reflow or sintering of a metallic component (27) of the ink. The ink (25) comprises a metallic component (27) and a flux but is substantially free of any resin or any reactive monomer or polymer.
IPC 1-7
IPC 8 full level
H05K 3/10 (2006.01); H05K 3/12 (2006.01); H05K 3/38 (2006.01); H05K 1/09 (2006.01); H05K 3/00 (2006.01)
CPC (source: EP)
H05K 3/102 (2013.01); H05K 3/1258 (2013.01); H05K 3/386 (2013.01); H05K 1/095 (2013.01); H05K 3/0023 (2013.01); H05K 3/107 (2013.01); H05K 2201/0272 (2013.01); H05K 2201/09863 (2013.01); H05K 2203/0425 (2013.01); H05K 2203/0568 (2013.01)
Citation (search report)
See references of WO 9622670A1
Designated contracting state (EPC)
DE FR GB IT
DOCDB simple family (publication)
WO 9622670 A1 19960725; AU 4397696 A 19960807; EP 0804865 A1 19971105
DOCDB simple family (application)
GB 9600105 W 19960118; AU 4397696 A 19960118; EP 96900386 A 19960118