EP 0806267 A1 19971112 - Cross-hatched polishing pad for polishing substrates in a chemical mechanical polishing system
Title (en)
Cross-hatched polishing pad for polishing substrates in a chemical mechanical polishing system
Title (de)
Schraffiertes Polierkissen zum Polieren eines Halbleitersubstrats in einem chemisch- mechanischen Poliersystem
Title (fr)
Patin de polissage haché pour polir un substrat dans un système de polissage chemico-mécanique
Publication
Application
Priority
US 64305496 A 19960502
Abstract (en)
A chemical mechanical polishing apparatus (30) including a platen (42) having a polishing surface (44) having a plurality of grooves (330,302) defining a plurality of polygonal projections (330). The grooves are uniformly spaced over the entire area of the polishing surface. A carrier head holds the substrate against the polishing surface. <IMAGE>
IPC 1-7
IPC 8 full level
B24B 37/00 (2006.01); B24B 37/04 (2006.01); B24B 37/26 (2012.01); B24D 13/14 (2006.01); H01L 21/304 (2006.01)
CPC (source: EP KR)
B24B 37/26 (2013.01 - EP); H01L 21/306 (2013.01 - KR)
Citation (search report)
- [X] US 5212910 A 19930525 - BREIVOGEL JOSEPH R [US], et al
- [X] WO 9404599 A1 19940303 - RODEL INC [US]
- [X] US 5022191 A 19910611 - BROIDO GEORGES H G [FR]
- [X] EP 0562718 A1 19930929 - SHINETSU HANDOTAI KK [JP]
- [X] EP 0439124 A2 19910731 - MICRON TECHNOLOGY INC [US]
- [X] WO 9607508 A1 19960314 - STRUERS AS [DK], et al
Designated contracting state (EPC)
AT BE CH DE ES FR GB GR IE IT LI NL SE
DOCDB simple family (publication)
EP 0806267 A1 19971112; JP H1071561 A 19980317; KR 970077301 A 19971212; TW 349896 B 19990111
DOCDB simple family (application)
EP 97302999 A 19970501; JP 14841097 A 19970501; KR 19970016955 A 19970502; TW 86105712 A 19970430