Global Patent Index - EP 0808337 A1

EP 0808337 A1 19971126 - EPOXY RESIN COMPOSITION CAPABLE OF CURE AT LOW TEMPERATURE

Title (en)

EPOXY RESIN COMPOSITION CAPABLE OF CURE AT LOW TEMPERATURE

Title (de)

BEI NIEDRIGER TEMPERATUR HÄRTBARE EPOXYHARZZUSAMMENSETZUNG

Title (fr)

COMPOSITION DE RESINE EPOXY CAPABLE DE DURCIR A BASSE TEMPERATURE

Publication

EP 0808337 A1 19971126 (EN)

Application

EP 95910961 A 19950210

Priority

US 9501674 W 19950210

Abstract (en)

[origin: WO9624628A1] An epoxy resin which is a reaction product of a polyepoxy and a polyol which contains both epoxy groups and terminal phenolic hydroxyl groups of at least 0.2 weight percent having added thereto an epoxy novolac having an epoxy functionality greater than two. The epoxy resin is suitable for use as a powder coating exhibiting lower melt viscosity than prior art resins of similar composition. The epoxy resin exhibits higher Tg/softening point than prior art resins of similar viscosity. A powder coating prepared from the resin may be used on temperature sensitive substrates.

IPC 1-7

C08G 59/06; C08G 59/38; C08G 59/62

IPC 8 full level

C08G 59/06 (2006.01); C08G 59/18 (2006.01); C08G 59/38 (2006.01); C08G 59/62 (2006.01)

CPC (source: EP)

C08G 59/066 (2013.01); C08G 59/182 (2013.01); C08G 59/38 (2013.01); C08G 59/621 (2013.01)

Citation (search report)

See references of WO 9624628A1

Designated contracting state (EPC)

DE FR GB IT

DOCDB simple family (publication)

WO 9624628 A1 19960815; AU 1873795 A 19960827; CZ 253297 A3 19980617; EP 0808337 A1 19971126; MX 9706096 A 19971129

DOCDB simple family (application)

US 9501674 W 19950210; AU 1873795 A 19950210; CZ 253297 A 19950210; EP 95910961 A 19950210; MX 9706096 A 19950210