EP 0815267 B1 19990324 - PROCESS AND DEVICE FOR INCREASING THE DEGREE OF ABSORPTION DURING SUPERFICIAL SOLID PHASE HARDENING OF WORKPIECES BY LASER RADIATION
Title (en)
PROCESS AND DEVICE FOR INCREASING THE DEGREE OF ABSORPTION DURING SUPERFICIAL SOLID PHASE HARDENING OF WORKPIECES BY LASER RADIATION
Title (de)
VERFAHREN UND VORRICHTUNG ZUR ERHÖHUNG DES ABSORPTIONSGRADES BEIM OBERFLÄCHEN-FESTPHASENHÄRTEN VON WERKSTÜCKEN MITTELS LASERSTRAHLUNG
Title (fr)
PROCEDE ET DISPOSITIF D'ACCROISSEMENT DU DEGRE D'ABSORPTION LORS DE LA TREMPE SUPERFICIELLE EN PHASE SOLIDE DE PIECES PAR RAYONNEMENT LASER
Publication
Application
Priority
- DE 19508584 A 19950313
- EP 9504581 W 19951121
Abstract (en)
[origin: DE19508584C1] A process and device are known to increase the degree of absorption during superficial solid phase hardening of workpieces by laser radiation, in particular for geometrically complex workpieces, by taking measures in the processing area during processing to increase laser radiation absorption. In order to create a process and device that allow the surface of workpieces having complex geometrical shapes in the finished state to be hardened without previously applying absorption-promoting coating layers, that allow an increased processing speed to be achieved in comparison with conventional processes and the hardening depth to be increased with comparable process parameters, a process gas is supplied to the processing area as a gaseous mixture of at least one inert gas and oxygen in order to increase laser radiation absorption, and the degree of absorption of laser radiation in the workpiece processing area is set depending on a predetermined set value depending on the proportion of the ingredients of the processing gas mixture, the processing gas volume flow and/or the temperature in the processing area during processing.
IPC 1-7
IPC 8 full level
B23K 26/00 (2006.01); B23K 26/03 (2006.01); B23K 26/06 (2014.01); B23K 26/12 (2014.01); B23K 26/14 (2006.01); B23K 26/18 (2006.01); C21D 1/09 (2006.01); C21D 1/76 (2006.01)
CPC (source: EP US)
B23K 26/03 (2013.01 - EP US); B23K 26/034 (2013.01 - EP US); B23K 26/0344 (2015.10 - EP US); B23K 26/0648 (2013.01 - EP US); B23K 26/0665 (2013.01 - EP US); B23K 26/12 (2013.01 - EP US); B23K 26/123 (2013.01 - EP US); B23K 26/18 (2013.01 - EP US); C21D 1/09 (2013.01 - EP US); C21D 1/76 (2013.01 - EP US)
Designated contracting state (EPC)
CH DE FR GB LI NL SE
DOCDB simple family (publication)
DE 19508584 C1 19960208; DE 59505467 D1 19990429; EP 0815267 A1 19980107; EP 0815267 B1 19990324; JP H11511807 A 19991012; US 5902420 A 19990511; WO 9628574 A1 19960919
DOCDB simple family (application)
DE 19508584 A 19950313; DE 59505467 T 19951121; EP 9504581 W 19951121; EP 95940224 A 19951121; JP 52719796 A 19951121; US 91349997 A 19971017