EP 0824847 A1 19980225 - HEATING ELEMENT, FABRICATION PROCESS AND APPLICATION
Title (en)
HEATING ELEMENT, FABRICATION PROCESS AND APPLICATION
Title (de)
HEIZELEMENT, HERSTELLUNGSVERFAHREN UND ANWENDUNG
Title (fr)
ELEMENT CHAUFFANT, PROCEDE DE FABRICATION ET APPLICATION
Publication
Application
Priority
- FR 9505329 A 19950504
- IB 9600390 W 19960430
Abstract (en)
[origin: US6054690A] PCT No. PCT/IB96/00390 Sec. 371 Date Feb. 19, 1998 Sec. 102(e) Date Feb. 19, 1998 PCT Filed Apr. 30, 1996 PCT Pub. No. WO96/35317 PCT Pub. Date Nov. 7, 1996A heating element includes at least one substrate, at least one electrical resistance layer, and a binder configured to bind the electrical resistance layer to the substrate, wherein the binder has a melting temperature greater than an operating temperature of the heating element and includes a perfluorinated polymer.
IPC 1-7
IPC 8 full level
H05B 3/20 (2006.01); D06F 75/24 (2006.01); D06F 75/26 (2006.01); H05B 3/28 (2006.01)
CPC (source: EP US)
D06F 75/24 (2013.01 - EP US); D06F 75/26 (2013.01 - EP US); H05B 3/28 (2013.01 - EP US); H05B 3/283 (2013.01 - EP US); H05B 3/286 (2013.01 - EP US); H05B 2203/003 (2013.01 - EP US)
Designated contracting state (EPC)
AT BE CH DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE
DOCDB simple family (publication)
WO 9635317 A1 19961107; AT E337693 T1 20060915; AU 5344596 A 19961121; CA 2220001 A1 19961107; DE 69636473 D1 20061005; DE 69636473 T2 20070823; EP 0824847 A1 19980225; EP 0824847 B1 20060823; FR 2733871 A1 19961108; FR 2733871 B1 19970606; JP 2007115702 A 20070510; JP H11505060 A 19990511; US 6054690 A 20000425
DOCDB simple family (application)
IB 9600390 W 19960430; AT 96910147 T 19960430; AU 5344596 A 19960430; CA 2220001 A 19960430; DE 69636473 T 19960430; EP 96910147 A 19960430; FR 9505329 A 19950504; JP 2006318838 A 20061127; JP 53315496 A 19960430; US 94555698 A 19980219