Global Patent Index - EP 0826239 A1

EP 0826239 A1 19980304 - A HEATSINK AND A METHOD AND AN ASSEMBLY FOR FORMING THE SAME

Title (en)

A HEATSINK AND A METHOD AND AN ASSEMBLY FOR FORMING THE SAME

Title (de)

EINE WÄRMESENKE UND EIN VERFAHREN UND ZUSAMMENBAU ZUR HERSTELLUNG DERSELBEN

Title (fr)

DISSIPATEUR DE CHALEUR, PROCEDE ET ENSEMBLE DESTINE A FORMER CELUI-CI

Publication

EP 0826239 A1 19980304 (EN)

Application

EP 96914275 A 19960515

Priority

  • GB 9601159 W 19960515
  • GB 9509863 A 19950516

Abstract (en)

[origin: GB2300974A] The invention provides a heatsink assembled from a planar base member (10) and a number of fin members (12). Each fin member has at least one fin portion (12a) and a base portion (12b) extending at an angle thereto. The fin member is attached to the base member by means of the base portion which, on fixing, lies coplanar with the base member. The fin member and base member are formed of thermally conductive material and preferably of the same material. The pin fin portions enhance the heat dissipation performance of the heatsink.

IPC 1-7

H01L 23/367

IPC 8 full level

H05K 7/20 (2006.01); H01L 23/36 (2006.01); H01L 23/367 (2006.01)

CPC (source: EP KR)

H01L 23/367 (2013.01 - KR); H01L 23/3672 (2013.01 - EP); H01L 2924/0002 (2013.01 - EP)

Citation (search report)

See references of WO 9636994A1

Designated contracting state (EPC)

DE FR GB IT

DOCDB simple family (publication)

GB 2300974 A 19961120; GB 2300974 B 19991229; GB 9509863 D0 19950712; AU 5768696 A 19961129; CN 1184558 A 19980610; EP 0826239 A1 19980304; JP H11505372 A 19990518; KR 19990014818 A 19990225; WO 9636994 A1 19961121

DOCDB simple family (application)

GB 9509863 A 19950516; AU 5768696 A 19960515; CN 96193944 A 19960515; EP 96914275 A 19960515; GB 9601159 W 19960515; JP 53463096 A 19960515; KR 19970708162 A 19971115