EP 0828262 A1 19980311 - Method of soldering lead wires to ceramic components
Title (en)
Method of soldering lead wires to ceramic components
Title (de)
Verfahren zum Anlöten von Anschlussdrähten an keramische Bauelemente
Title (fr)
Procédé pour souder des fils de connexion à des composants céramiques
Publication
Application
Priority
DE 19636577 A 19960909
Abstract (en)
The method involves soldering connector wires to ceramic components. Before soldering, a solder tape (3) provided with a flux agent, is applied to the wire (1) to be soldered. The solder band (3) is preferably attached to the wire (1) using a device (2,4) by means of a mechanical bending process. The solder tape (3) is preferably mechanically fastened to the connection wire (1) using a movable device (2) in which the tape (3) and then the wire (1) are laid, and a counter component (4) which moves relative to the device (2) to bend the tape (3).
Abstract (de)
Bei einem Verfahren zum Anlöten von Anschlußdrähten (1) an keramische Bauelemente wird vor dem Anlöten ein mit einem Flußmittel versehenes Lotband (3) auf den zu verlötenden Anschlußdraht (1) aufgebracht. <IMAGE>
IPC 1-7
IPC 8 full level
H01C 1/14 (2006.01); H01C 1/144 (2006.01); H01C 17/28 (2006.01)
CPC (source: EP)
H01C 1/1406 (2013.01); H01C 1/144 (2013.01); H01C 17/28 (2013.01)
Citation (search report)
- [X] US 4915286 A 19900410 - MENTZER REGIS [FR], et al
- [A] PATENT ABSTRACTS OF JAPAN vol. 011, no. 314 (E - 549) 13 October 1987 (1987-10-13)
- [A] PATENT ABSTRACTS OF JAPAN vol. 010, no. 313 (E - 448) 24 October 1986 (1986-10-24)
Designated contracting state (EPC)
DE ES IT SE
DOCDB simple family (publication)
EP 0828262 A1 19980311; BR 9704670 A 19990330; DE 19636577 C1 19980409
DOCDB simple family (application)
EP 97114226 A 19970818; BR 9704670 A 19970909; DE 19636577 A 19960909