Global Patent Index - EP 0828864 A1

EP 0828864 A1 19980318 - METHOD AND APPARATUS FOR COATING A METAL STRIP WITH A METAL OR ALLOY WITH A LOWER MELTING OR LIQUIDUS POINT THAN THE STRIP MATERIAL

Title (en)

METHOD AND APPARATUS FOR COATING A METAL STRIP WITH A METAL OR ALLOY WITH A LOWER MELTING OR LIQUIDUS POINT THAN THE STRIP MATERIAL

Title (de)

VERFAHREN UND VORRICHTUNG ZUM BESCHICHTUNG EINES METALLISCHEN BANDES MIT EINEM METAL ODER EINER LEGIERUNG MIT NIEDRIGEN SCHMELZPUNKT ODER LIQUIDESPUNKT WIE DAS MATERIAL AUS DEM DAS BAND BESTEHT

Title (fr)

PROCEDE ET DISPOSITIF POUR REVETIR UNE BANDE METALLIQUE D'UN METAL OU D'UN ALLIAGE A PLUS BAS POINT DE FUSION OU DE LIQUIDE QUE CELUI DU MATERIAU CONSTITUANT LA BANDE

Publication

EP 0828864 A1 19980318 (FR)

Application

EP 96913420 A 19960517

Priority

  • CH 9600191 W 19960517
  • CH 157895 A 19950529

Abstract (en)

[origin: WO9638599A1] A metal strip (13), which has previously been cleaned, dried and inductively preheated, is fed through a melted metal or alloy bath in an enclosure (10) which it enters at a lower inlet thereof (11) and exits by an upper outlet (12) of the enclosure (10). The coating metal or alloy is heated in a crucible (1) and fed into the enclosure (10) heated by resistors (16a, 16b, 17a, 17b) through two channels (7a, 8a, 7b, 8b) opening on each side of the strip (13). The lower inlet (11), and, preferably, the upper outlet (12), are provided between two inserts (14a, 14b; 15a, 15b) made of a refractory material, non-wettable by the melted metal or alloy.

IPC 1-7

C23C 2/00

IPC 8 full level

C23C 2/06 (2006.01); C23C 2/00 (2006.01); C23C 2/20 (2006.01); C23C 2/40 (2006.01)

CPC (source: EP US)

C23C 2/00362 (2022.08 - EP US)

Designated contracting state (EPC)

BE DE FR GB IT LU NL

DOCDB simple family (publication)

WO 9638599 A1 19961205; EP 0828864 A1 19980318; JP H11505885 A 19990525

DOCDB simple family (application)

CH 9600191 W 19960517; EP 96913420 A 19960517; JP 53607296 A 19960517