Global Patent Index - EP 0831547 B1

EP 0831547 B1 2002-11-06 - Microstrip antenna

Title (en)

Microstrip antenna

Title (de)

Mikrostreifenleiterantenne

Title (fr)

Antenne microruban

Publication

EP 0831547 B1 (EN)

Application

EP 97116094 A

Priority

JP 25014096 A

Abstract (en)

[origin: EP0831547A2] A microstrip antenna (1) has a dielectric-made substrate (11). A first radiation-electrode (12) is formed on one main surface of the substrate (11). Second radiation-electrodes (13, 14) are formed on the periphery of the first radiation-electrode (12) with a spacing between the first radiation-electrode (12) and each of the second radiation electrodes (13, 14). A ground electrode (15) is formed on the other main surface of the substrate (11). A power-feeding through-hole 16 is provided at a position corresponding to the first radiation-electrode (12) on the substrate (11). A plurality of through-holes (17) are provided at positions corresponding to the second radiation-electrode (13) on the substrate (11). Capacitive-coupling portions (18a, 18b) are provided to capacitively couple the first radiation-electrode (12) and the second radiation-electrodes (13, 14), respectively. A connector (19), serving as a coaxial line, for feeding power to the first radiation electrode (12) is inserted into and past the feeding through-hole (16) from the other main surface of the substrate (11). The connector (19) is electrically connected to the first radiation-electrode (12) with solder (20a) and is fixed to the substrate (11) with solder (20a, 20b). The second radiation-electrodes (13, 14) are connected to the ground electrode (15) via the through-holes (17). <IMAGE>

IPC 1-7 (main, further and additional classification)

H01Q 9/04

IPC 8 full level (invention and additional information)

H01Q 13/08 (2006.01); H01Q 5/10 (2015.01); H01Q 9/04 (2006.01); H01Q 19/00 (2006.01)

CPC (invention and additional information)

H01Q 9/0407 (2013.01); H01Q 5/378 (2013.01); H01Q 5/385 (2013.01); H01Q 19/005 (2013.01)

Designated contracting state (EPC)

DE FI FR GB SE

EPO simple patent family

EP 0831547 A2 19980325; EP 0831547 A3 19980401; EP 0831547 B1 20021106; DE 69716850 D1 20021212; DE 69716850 T2 20030911; JP 3180683 B2 20010625; JP H1098329 A 19980414; NO 319499 B1 20050822; NO 974187 A 19980323; NO 974187 D0 19970911

INPADOC legal status


2011-08-31 [PG25 GB] LAPSED IN A CONTRACTING STATE ANNOUNCED VIA POSTGRANT INFORM. FROM NAT. OFFICE TO EPO

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2011-07-21 [REG DE R119] APPLICATION DEEMED WITHDRAWN, OR IP RIGHT LAPSED, DUE TO NON-PAYMENT OF RENEWAL FEE

- Document: DE 69716850

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2011-06-24 [REG FR ST] NOTIFICATION OF LAPSE

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2002-12-12 [REF] CORRESPONDS TO:

- Document: DE 69716850 20021212

2002-11-06 [AK] DESIGNATED CONTRACTING STATES:

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2002-11-06 [REG GB FG4D] EUROPEAN PATENT GRANTED

2002-11-06 [PG25 FI] LAPSED IN A CONTRACTING STATE ANNOUNCED VIA POSTGRANT INFORM. FROM NAT. OFFICE TO EPO

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2001-08-22 [17Q] FIRST EXAMINATION REPORT

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1998-12-16 [AKX] PAYMENT OF DESIGNATION FEES

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1998-12-16 [RBV] DESIGNATED CONTRACTING STATES (CORRECTION)

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