EP 0833874 A1 19980408 - ADHESIVE COMPOSITIONS, BONDING FILMS MADE THEREFROM AND PROCESSES FOR MAKING BONDING FILMS
Title (en)
ADHESIVE COMPOSITIONS, BONDING FILMS MADE THEREFROM AND PROCESSES FOR MAKING BONDING FILMS
Title (fr)
COMPOSITIONS ADHESIVES, FILMS DE LIAISON DERIVES ET PROCEDES DE FABRICATION DE FILMS DE LIAISON
Publication
Application
Priority
- US 9609412 W 19960605
- US 49326395 A 19950621
Abstract (en)
[origin: WO9700923A1] A photostable adhesive composition comprises: a) an aromatic polyepoxide; b) a heat activated curative for polyepoxide; c) a thermoplastic polymer; d) a polyfunction (meth)acrylate; and e) optionally, a bireactive compound that contains at least one (meth)acrylate group and at least one group that is reactive with aromatic polyepoxide. The adhesive compositions can be used to prepare adhesive bonding films in a process that uses electron beam irradiation.
IPC 1-7
IPC 8 full level
C09J 4/06 (2006.01); C08F 283/10 (2006.01); C08G 59/50 (2006.01); C08G 59/70 (2006.01); C09J 4/02 (2006.01); C09J 163/00 (2006.01); H05K 3/38 (2006.01)
CPC (source: EP KR)
C08F 283/10 (2013.01 - EP); C08G 59/50 (2013.01 - EP); C08G 59/70 (2013.01 - EP); C09J 163/00 (2013.01 - EP KR); C09J 181/06 (2013.01 - KR); C08L 2666/02 (2013.01 - EP); H05K 3/386 (2013.01 - EP)
Citation (search report)
See references of WO 9700923A1
Designated contracting state (EPC)
DE FR GB IE IT SE
DOCDB simple family (publication)
WO 9700923 A1 19970109; AU 6099196 A 19970122; CA 2224809 A1 19970109; EP 0833874 A1 19980408; JP H11508301 A 19990721; KR 19990028271 A 19990415
DOCDB simple family (application)
US 9609412 W 19960605; AU 6099196 A 19960605; CA 2224809 A 19960605; EP 96918301 A 19960605; JP 50386197 A 19960605; KR 19970709585 A 19971220