Global Patent Index - EP 0834180 B1

EP 0834180 B1 2000-05-17 - METHOD AND APPARATUS FOR A SURFACE-MOUNTABLE DEVICE FOR PROTECTION AGAINST ELECTROSTATIC DAMAGE TO ELECTRONIC COMPONENTS

Title (en)

METHOD AND APPARATUS FOR A SURFACE-MOUNTABLE DEVICE FOR PROTECTION AGAINST ELECTROSTATIC DAMAGE TO ELECTRONIC COMPONENTS

Title (de)

VERFAHREN UND VORRICHTUNG FÜR EIN SMD-ELEMENT ZUM SCHÜTZEN DER ELEKTRISCHEN KOMPONENTEN GEGEN ESD

Title (fr)

PROCEDE ET APPAREIL DESTINE A UN DISPOSITIF MONTABLE EN SURFACE POUR LA PROTECTION CONTRE LES DOMMAGES ELECTROSTATIQUES SUBIS PAR LES COMPOSANTS ELECTRONIQUES

Publication

EP 0834180 B1 (EN)

Application

EP 96925471 A

Priority

  • US 9612217 W
  • US 47494095 A
  • US 47450295 A

Abstract (en)

[origin: WO9641356A2] The thin film, circuit device is a subminiature overvoltage protection device in a surface mountable configuration for use in printed circuit board or thick film hybrid circuit technology. The surface mountable device (SMD) is designed to protect against electrostatic discharge (ESD) damage to electronic components. The circuit protection device comprises three material subassemblies. The first subassembly generally includes a substrate carrier, electrodes, and terminal pads for connecting the protection device (60) to a PC board. The second subassembly includes a voltage variable polymer material with non-linear characteristics, and the third subassembly includes a cover coat for protecting other elements of the circuit protection device.

IPC 1-7 (main, further and additional classification)

H01C 7/10; H01C 7/00; H01C 7/12

IPC 8 full level (invention and additional information)

H01C 7/00 (2006.01); H01C 7/10 (2006.01); H01C 7/12 (2006.01); H01C 17/08 (2006.01)

CPC (invention and additional information)

H01C 7/006 (2013.01); H01C 7/1013 (2013.01); H01C 7/12 (2013.01); H01C 17/08 (2013.01)

Designated contracting state (EPC)

AT BE CH DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE

EPO simple patent family

WO 9641356 A2 19961219; WO 9641356 A3 19970130; AT 193149 T 20000615; AU 6597296 A 19961230; CA 2223746 A1 19961219; CN 1191623 A 19980826; DE 69608440 D1 20000621; DE 69608440 T2 20010104; EP 0834180 A2 19980408; EP 0834180 B1 20000517; JP H11507766 A 19990706; MX 9709973 A 19980628

INPADOC legal status


2002-04-03 [PG25 DE] LAPSED IN A CONTRACTING STATE ANNOUNCED VIA POSTGRANT INFORM. FROM NAT. OFFICE TO EPO

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2002-02-28 [PG25 FR] LAPSED IN A CONTRACTING STATE ANNOUNCED VIA POSTGRANT INFORM. FROM NAT. OFFICE TO EPO

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2001-05-09 [26N] NO OPPOSITION FILED

2001-04-11 [GBPC] GB: EUROPEAN PATENT CEASED THROUGH NON-PAYMENT OF RENEWAL FEE

- Effective date: 20000817

2001-04-04 [REG IE MM4A] PATENT LAPSED

2000-11-30 [REG CH PL] PATENT CEASED

2000-11-01 [NLV1] NL: LAPSED OR ANNULLED DUE TO FAILURE TO FULFILL THE REQUIREMENTS OF ART. 29P AND 29M OF THE PATENTS ACT

2000-09-01 [ET] FR: TRANSLATION FILED

2000-08-17 [PG25 GB] LAPSED IN A CONTRACTING STATE ANNOUNCED VIA POSTGRANT INFORM. FROM NAT. OFFICE TO EPO

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2000-06-21 [REF] CORRESPONDS TO:

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2000-05-31 [REG CH EP] ENTRY IN THE NATIONAL PHASE

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2000-05-17 [AK] DESIGNATED CONTRACTING STATES:

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2000-05-17 [PG25 ES] LAPSED IN A CONTRACTING STATE ANNOUNCED VIA POSTGRANT INFORM. FROM NAT. OFFICE TO EPO

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2000-05-17 [REF] CORRESPONDS TO:

- Document: AT 193149 T 20000615

1998-05-27 [17Q] FIRST EXAMINATION REPORT

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1998-04-08 [17P] REQUEST FOR EXAMINATION FILED

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