Global Patent Index - EP 0834180 B1

EP 0834180 B1 20000517 - METHOD AND APPARATUS FOR A SURFACE-MOUNTABLE DEVICE FOR PROTECTION AGAINST ELECTROSTATIC DAMAGE TO ELECTRONIC COMPONENTS

Title (en)

METHOD AND APPARATUS FOR A SURFACE-MOUNTABLE DEVICE FOR PROTECTION AGAINST ELECTROSTATIC DAMAGE TO ELECTRONIC COMPONENTS

Title (de)

VERFAHREN UND VORRICHTUNG FÜR EIN SMD-ELEMENT ZUM SCHÜTZEN DER ELEKTRISCHEN KOMPONENTEN GEGEN ESD

Title (fr)

PROCEDE ET APPAREIL DESTINE A UN DISPOSITIF MONTABLE EN SURFACE POUR LA PROTECTION CONTRE LES DOMMAGES ELECTROSTATIQUES SUBIS PAR LES COMPOSANTS ELECTRONIQUES

Publication

EP 0834180 B1 20000517 (EN)

Application

EP 96925471 A 19960606

Priority

  • US 9612217 W 19960606
  • US 47494095 A 19950607
  • US 47450295 A 19950607

Abstract (en)

[origin: WO9641356A2] The thin film, circuit device is a subminiature overvoltage protection device in a surface mountable configuration for use in printed circuit board or thick film hybrid circuit technology. The surface mountable device (SMD) is designed to protect against electrostatic discharge (ESD) damage to electronic components. The circuit protection device comprises three material subassemblies. The first subassembly generally includes a substrate carrier, electrodes, and terminal pads for connecting the protection device (60) to a PC board. The second subassembly includes a voltage variable polymer material with non-linear characteristics, and the third subassembly includes a cover coat for protecting other elements of the circuit protection device.

IPC 1-7

H01C 7/10; H01C 7/00; H01C 7/12

IPC 8 full level

H01C 7/00 (2006.01); H01C 7/10 (2006.01); H01C 7/12 (2006.01); H01C 17/08 (2006.01)

CPC (source: EP)

H01C 7/006 (2013.01); H01C 7/1013 (2013.01); H01C 7/12 (2013.01); H01C 17/08 (2013.01)

Designated contracting state (EPC)

AT BE CH DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE

DOCDB simple family (publication)

WO 9641356 A2 19961219; WO 9641356 A3 19970130; AT E193149 T1 20000615; AU 6597296 A 19961230; CA 2223746 A1 19961219; CN 1191623 A 19980826; DE 69608440 D1 20000621; DE 69608440 T2 20010104; EP 0834180 A2 19980408; EP 0834180 B1 20000517; JP H11507766 A 19990706; MX 9709973 A 19980628

DOCDB simple family (application)

US 9612217 W 19960606; AT 96925471 T 19960606; AU 6597296 A 19960606; CA 2223746 A 19960606; CN 96195759 A 19960606; DE 69608440 T 19960606; EP 96925471 A 19960606; JP 50232397 A 19960606; MX 9709973 A 19971208