EP 0834956 B1 20011219 - Covered wire connection method and structure
Title (en)
Covered wire connection method and structure
Title (de)
Verfahren und Stuktur zur Kontaktierung umhüllter Drähte
Title (fr)
Procédé et structure de connexion de fils conducteurs couverts
Publication
Application
Priority
JP 26092896 A 19961001
Abstract (en)
[origin: EP0834956A2] Two covered wires (W1,W2) conductively connected are overlapped with each other at connection portions. The overlapped connection portions are pinched by a pair of resin chips (13,15). By melting cover portions and pressing resin chips from outside, the conductive wire portions (1) of the covered wires are conductively contacted with each other at the connection portions. The pair of the resin chips (13,15) are melt-fixed to each other to seal the connection portions. A crossing angle θ of the two covered wires (W1,W2) at the connection portion is set to not less than 45 DEG to not greater than 135 DEG . Thus, the covered wires can be conductively connected with each other at cheap price easily. Further, a connecting state having an excellent electrical characteristic can be obtained stably.
IPC 1-7
IPC 8 full level
H01R 4/70 (2006.01); H01R 43/02 (2006.01)
CPC (source: EP)
H01R 4/70 (2013.01); H01R 43/0207 (2013.01); H01R 43/0228 (2013.01)
Designated contracting state (EPC)
BE FR GB IT NL SE
DOCDB simple family (publication)
EP 0834956 A2 19980408; EP 0834956 A3 19981007; EP 0834956 B1 20011219; AU 3987297 A 19980409; AU 702342 B2 19990218; CA 2217146 A1 19980401; CA 2217146 C 20000523; CN 1067492 C 20010620; CN 1182293 A 19980520; KR 19980032460 A 19980725
DOCDB simple family (application)
EP 97117001 A 19970930; AU 3987297 A 19971001; CA 2217146 A 19971001; CN 97119388 A 19970930; KR 19970050740 A 19971001