Global Patent Index - EP 0835523 A1

EP 0835523 A1 19980415 - PROCESS FOR PACKAGING A PRESSURE-SENSITIVE ELECTRONIC CIRCUIT IN A PROTECTIVE HOUSING SEALED ALL AROUND

Title (en)

PROCESS FOR PACKAGING A PRESSURE-SENSITIVE ELECTRONIC CIRCUIT IN A PROTECTIVE HOUSING SEALED ALL AROUND

Title (de)

VERFAHREN ZUM VERPACKEN EINER DRUCKEMPFINDLICHEN ELEKTRONISCHEN SCHALTUNG MIT EINER ALLSEITIG ABDICHTENDEN SCHUTZUMHÄUSUNG

Title (fr)

PROCEDE DE CONDITIONNEMENT D'UN CIRCUIT ELECTRONIQUE SENSIBLE A LA PRESSION DANS UN BOITIER PROTECTEUR ETANCHE DE TOUS LES COTES

Publication

EP 0835523 A1 19980415 (DE)

Application

EP 96917348 A 19960614

Priority

  • DE 9601056 W 19960614
  • DE 19524001 A 19950630

Abstract (en)

[origin: WO9702601A1] A process is disclosed for packaging a pressure-sensitive electronic circuit in a protective housing sealed all around. A plastic housing open on one side is injection-moulded around a printed circuit board (1) which is then equipped with electronic components. The thus obtained unit (5) is placed in a second injection mould that may be composed of two halves that can be successively and individually filled with injection moulding plastic material. A preform (6) that closes the opening of the plastic housing (4) at a certain distance from the circuit is injection moulded into the first half of the injection mould. The second half of the injection mould is then moved nearer to the first half and finished form (7) is injection moulded therein so as to seal the plastic housing (4) closed by the injection moulded preform (6).

IPC 1-7

H01L 23/31; H01L 21/56

IPC 8 full level

H01L 21/56 (2006.01); H01L 23/31 (2006.01)

CPC (source: EP)

B29C 45/14655 (2013.01); B29C 45/1671 (2013.01); H01L 21/56 (2013.01); H01L 23/315 (2013.01); B29C 2045/1673 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/48247 (2013.01); H01L 2924/15153 (2013.01); H01L 2924/3025 (2013.01)

Citation (search report)

See references of WO 9702601A1

Designated contracting state (EPC)

BE DE FR GB IT SE

DOCDB simple family (publication)

WO 9702601 A1 19970123; DE 19524001 A1 19970306; EP 0835523 A1 19980415

DOCDB simple family (application)

DE 9601056 W 19960614; DE 19524001 A 19950630; EP 96917348 A 19960614