EP 0838133 B1 19981028 - DEVICE FOR MOUNTING ELECTRICAL COMPONENTS ON PRINTED-CIRCUIT BOARDS
Title (en)
DEVICE FOR MOUNTING ELECTRICAL COMPONENTS ON PRINTED-CIRCUIT BOARDS
Title (de)
VORRICHTUNG ZUR MONTAGE ELEKTRISCHER BAUTEILE AUF LEITERPLATTEN
Title (fr)
DISPOSITIF POUR MONTER DES COMPOSANTS ELECTRIQUES SUR DES CARTES DE CIRCUITS
Publication
Application
Priority
- CH 9700059 W 19970218
- CH 120896 A 19960510
Abstract (en)
[origin: WO9743883A1] The invention concerns a device for mounting electrical and electronic components (3) on printed-circuit boards or hybrids (1) with low thermal expansion, such as thermally stressed high-frequency power transformers on printed-circuit boards (1) made of aluminium oxide-ceramics. The component (3) comprises through-holes (6) which pass through a contact plate (7). Disposed in each of the holes (6) is a metal pin (8) whose upper part is pressed into the contact plate (7) so that the metal pin thus forms a force-locking electrically conductive cold weld therewith. At its other end, the metal pin (8) is soldered flush, for example, to a printed conductor (2). The transverse dimension of the metal pin (8) is smaller than the diameter of the hole (6), such that the metal pin (8) has a given amount of freedom of movement. In this way, differences between the thermal expansion of the component (3) and the printed-circuit board (1) can be compensated.
IPC 1-7
IPC 8 full level
H05K 1/18 (2006.01); H05K 3/34 (2006.01); H05K 1/02 (2006.01)
CPC (source: EP)
H01R 12/57 (2013.01); H05K 3/3426 (2013.01); H01R 12/716 (2013.01); H05K 1/0271 (2013.01); H05K 2201/1003 (2013.01); H05K 2201/10848 (2013.01); Y02P 70/50 (2015.11)
Designated contracting state (EPC)
CH DE FR GB LI SE
DOCDB simple family (publication)
WO 9743883 A1 19971120; DE 59700033 D1 19981203; EP 0838133 A1 19980429; EP 0838133 B1 19981028
DOCDB simple family (application)
CH 9700059 W 19970218; DE 59700033 T 19970218; EP 97902142 A 19970218