Global Patent Index - EP 0843326 A2

EP 0843326 A2 19980520 - Chip type electronic part

Title (en)

Chip type electronic part

Title (de)

Chipelektronikbauteil

Title (fr)

Dispositif électronique du type pièce

Publication

EP 0843326 A2 19980520 (EN)

Application

EP 97120307 A 19971119

Priority

JP 30848496 A 19961119

Abstract (en)

A chip type electronic part of the present invention includes tapered notches rising from the bottom of the body of a molding. With this configuration, the electronic part achieves a high volume efficiency and a great bonding strength to a circuit board after soldering. <IMAGE>

IPC 1-7

H01G 2/06

IPC 8 full level

H01G 2/06 (2006.01); H01G 9/004 (2006.01); H01G 9/08 (2006.01); H05K 3/34 (2006.01)

CPC (source: EP US)

H01G 2/065 (2013.01 - EP US); H05K 3/3426 (2013.01 - EP US); H01L 2924/0002 (2013.01 - EP US); H01L 2924/1815 (2013.01 - EP US); Y02P 70/50 (2015.11 - EP US)

Designated contracting state (EPC)

DE GB SE

DOCDB simple family (publication)

EP 0843326 A2 19980520; EP 0843326 A3 19990825; JP 3175609 B2 20010611; JP H10149953 A 19980602; US 5952715 A 19990914

DOCDB simple family (application)

EP 97120307 A 19971119; JP 30848496 A 19961119; US 97434797 A 19971119