Global Patent Index - EP 0846781 B1

EP 0846781 B1 20001115 - Process of forming an aluminium sheet with excellent high speed superplastic formability

Title (en)

Process of forming an aluminium sheet with excellent high speed superplastic formability

Title (de)

Verfahren zur Herstellung eines Aluminiumbleches mit hervorragender Hochgeschwindigkeitssuperplastizität

Title (fr)

Procédé de production d'une tole en alliage d'aluminium presentant une excellente aptitude au formage superplastique à haute vitesse.

Publication

EP 0846781 B1 20001115 (EN)

Application

EP 95940435 A 19951212

Priority

  • JP 9502564 W 19951212
  • JP 23770795 A 19950823

Abstract (en)

[origin: WO9708354A1] An alloy containing 3.0 to 8.0 wt.% of Mg, 0.001 to 0.1 wt.% of Ti and as small amounts of Fe and Si (as impurities) as 0.06 wt.% or below and the balance consisting of A1 and unavoidable impurities wherein the number per square millimeter of grains of an Al-Fe-Si compound having a diameter of 1 mu m or above is 2000 or below, the mean crystal grain diameter is 25 to 200 mu m and the elongation is 350 % or above as worked at 350 to 550 DEG C and a strain rate of 10<-2> to 10<0>/s. This alloy may further contain a small amount of Cu, Mn and/or Cr and is formed at a temperature of 350 to 550 DEG C and a strain rate of 10<-3> to 10<0>/s. An aluminum alloy sheet which is excellent in high-speed superplastic formability and therefore can be formed at high temperature and high speed is obtained and the use of this sheet shortens the forming time to improve the productivity.

IPC 1-7

C22C 21/06; C22F 1/047

IPC 8 full level

B21B 3/00 (2006.01); C22C 21/00 (2006.01); C22C 21/06 (2006.01); C22F 1/00 (2006.01); C22F 1/047 (2006.01)

CPC (source: EP US)

C22C 21/06 (2013.01 - EP US); C22F 1/047 (2013.01 - EP US)

Designated contracting state (EPC)

DE FR GB

DOCDB simple family (publication)

WO 9708354 A1 19970306; DE 69519444 D1 20001221; DE 69519444 T2 20010613; EP 0846781 A1 19980610; EP 0846781 A4 19981118; EP 0846781 B1 20001115; JP 3145904 B2 20010312; JP H0959736 A 19970304; US 2001001969 A1 20010531

DOCDB simple family (application)

JP 9502564 W 19951212; DE 69519444 T 19951212; EP 95940435 A 19951212; JP 23770795 A 19950823; US 9798 A 19980116