EP 0847835 B1 20010725 - Method and apparatus for polishing semiconductor substrates
Title (en)
Method and apparatus for polishing semiconductor substrates
Title (de)
Verfahren und Vorrichtung zum Polieren von Halbleiterscheiben
Title (fr)
Procédé et dispositif pour le polissage des plaquettes semiconductrices
Publication
Application
Priority
DE 19651761 A 19961212
Abstract (en)
[origin: EP0847835A1] The method involves polishing the discs (10a) with a polishing head (2) by pressing them against a polishing cloth stretched over a polishing disc (13). At least one of a number of pressure chambers are pressurised at a specific pressure before the discs are polished. During the polishing process the polishing pressure is transferred to the rear surface (6) of the wafer (1) carrying the discs by the flexible bearing surface (5) of the pressurized pressure chambers. If several pressure chambers are pressurised the pressures in the chambers can be balanced
IPC 1-7
IPC 8 full level
B24B 37/04 (2006.01); B24B 37/30 (2012.01); B24B 41/047 (2006.01); B24B 49/16 (2006.01); B25J 15/06 (2006.01); H01L 21/304 (2006.01)
CPC (source: EP KR US)
B24B 37/30 (2013.01 - EP US); B24B 41/047 (2013.01 - EP US); B24B 49/16 (2013.01 - EP US); H01L 21/321 (2013.01 - KR)
Designated contracting state (EPC)
DE GB IT
DOCDB simple family (publication)
EP 0847835 A1 19980617; EP 0847835 B1 20010725; CN 1123423 C 20031008; CN 1185028 A 19980617; DE 19651761 A1 19980618; DE 59704120 D1 20010830; JP 3150933 B2 20010326; JP H10180617 A 19980707; KR 100278027 B1 20010201; KR 19980063896 A 19981007; SG 60162 A1 19990222; TW 411525 B 20001111; US 5980361 A 19991109
DOCDB simple family (application)
EP 97121841 A 19971211; CN 97118946 A 19970929; DE 19651761 A 19961212; DE 59704120 T 19971211; JP 33894397 A 19971209; KR 19970066694 A 19971208; SG 1997004221 A 19971202; TW 86118563 A 19971209; US 98751597 A 19971209