EP 0849373 A1 19980624 - Strip shaped composite material, process and apparatus for making it
Title (en)
Strip shaped composite material, process and apparatus for making it
Title (de)
Bandförmiges Verbundmaterial sowie Verfahren und Vorrichtung zu dessen Herstellung
Title (fr)
Matériau composite en bande, procédé et appareil de sa fabrication
Publication
Application
Priority
DE 19652987 A 19961219
Abstract (en)
In a composite strip of metal or metal alloy, preferably copper, iron, nickel, zinc or their alloys, with an electroplated or hot dip coated pure tin or tin alloy layer and an intermetallic phase formed between the two, 1-50 at.%, preferably 6-30 at.%, carbon is incorporated in the tin coating outer surface region of up to 2 mu m thickness. Also claimed are: (i) the production of the above composite strip, in which a tinned metal strip is pulled, with a dwell time of 1-130 minutes, preferably 2-4 minutes, through a hot oil bath at above the tinned layer m. pt. or is sprayed with oil immediately after tinning, the oil being a natural or synthetic paraffin, ester and/or fatty acid based oil with usual additives; and (ii) an apparatus for carrying out the above process, comprising an unwinding reel (6), a hot oil passageway (3), a thermal lock chamber (10), a cold oil passageway (5) and a winding reel (14).
Abstract (de)
Die Erfindung betrifft ein bandförmiges Verbundmaterial mit einem Grundmaterial aus Metall/Metall-Legierung und einer Zinn-Beschichtung auf der Oberfläche, wobei zwischen beiden Materialien eine intermetallische Phase (IMP) ausgebildet ist. Insbesondere zur Erzielung guter Verschleiß- und Korrosionsbeständigkeit des Verbundmaterials bei gleichzeitig oxidfreier Oberfläche sind in einem äußeren Randabschnitt der Zinn-Beschichtung bis zu einer Dicke D von etwa 2 µm 1 bis 50 At.-%, vorzugsweise 6 bis 30 At.-%, Kohlenstoff (C) eingelagert. Gleichzeitig werden Verfahren (Ölbehandlung) und Vorrichtung zur Herstellung des erfindungsgemäßen Verbundmaterials angegeben. <IMAGE>
IPC 1-7
IPC 8 full level
C23C 2/08 (2006.01); C23C 2/28 (2006.01); C25D 5/50 (2006.01); C25D 7/00 (2006.01)
CPC (source: EP US)
C23C 2/08 (2013.01 - EP US); C25D 5/505 (2013.01 - EP US); Y10S 428/939 (2013.01 - EP US); Y10T 428/12708 (2015.01 - EP US); Y10T 428/12715 (2015.01 - EP US)
Citation (search report)
- [A] DE 2419716 A1 19741107 - STEPHANOIS RECH MEC
- [A] US 2274963 A 19420303 - WILLIAM HOPPER EDWARD
- [A] GB 191202423 A 19121212 - LOEWY BERNHARD [AT], et al
- [A] BE 569612 A
- [A] A.D. JONES: "solder coating thin copper wire", IBM TECHNICAL DISCLOSURE BULLETIN, vol. 11, no. 7, December 1968 (1968-12-01), pages 876, XP002060662
- [A] PATENT ABSTRACTS OF JAPAN vol. 008, no. 114 (C - 225) 26 May 1984 (1984-05-26)
Designated contracting state (EPC)
BE DE ES FI FR GB IT NL SE
DOCDB simple family (publication)
EP 0849373 A1 19980624; EP 0849373 B1 20010321; CN 1168844 C 20040929; CN 1195034 A 19981007; DE 19652987 A1 19980625; DE 19652987 C2 20001005; DE 59703183 D1 20010426; ES 2156330 T3 20010616; JP H10195692 A 19980728; MY 125545 A 20060830; US 6099977 A 20000808
DOCDB simple family (application)
EP 97121506 A 19971206; CN 97114360 A 19971205; DE 19652987 A 19961219; DE 59703183 T 19971206; ES 97121506 T 19971206; JP 36394997 A 19971217; MY PI9705740 A 19971128; US 99060697 A 19971215