EP 0849755 A2 19980624 - Electromagnetic relay for high heat load
Title (en)
Electromagnetic relay for high heat load
Title (de)
Elektromagnetisches Relais für hohe Wärmebelastung
Title (fr)
Relais électromagnétique pour charge thermique élevée
Publication
Application
Priority
DE 19653105 A 19961219
Abstract (en)
[origin: DE19653105C1] An electromagnetic relay including a U-shaped core yoke (5) carrying a bobbin with a winding (2), and a flat armature (9) bridging the free ends (6a,8a) of the yoke (5) when the coil is excited. A switching tongue (14) is arranged in a plane approx. parallel to the armature (9), and comprises a long strip fixed at one end and supporting at least one movable contact (14a) at the other. At least one pair of fixed counter-contacts (12,13) are bridged by the tongue (14) in one of their switching positions. The switching tongue (14) specifically. made of ceramic consists of a highly insulating material having a high degree of rigidity and slight relaxation properties at high temperatures, with a bridging contact (14a) made of a high-conductivity material at its contact-making end.
Abstract (de)
Das Relais besitzt einen Spulenkörper (1), der vorzugsweise aus Keramik besteht, mit einer Wicklung (2) und einem U-förmigen Kernjoch (5), dessen Enden von einem flachen Anker (9) überbrückt werden. Der Anker betätigt eine isolierende Schaltfeder (14) aus Keramik oder einem ähnlichen Material, welche an ihrem beweglichen Ende mit einem Brückenkontakt (14a) zwei Gegenkontakte überbrückt. Das Relais kann auch bei sehr kleiner Ausführung in hoher Umgebungstemperatur eingesetzt werden. <IMAGE>
IPC 1-7
IPC 8 full level
H01H 50/18 (2006.01); H01H 50/56 (2006.01); H01H 51/06 (2006.01); H01H 1/56 (2006.01); H01H 50/44 (2006.01)
CPC (source: EP US)
H01H 50/18 (2013.01 - EP US); H01H 50/56 (2013.01 - EP US); H01H 1/56 (2013.01 - EP US); H01H 50/44 (2013.01 - EP US); H01H 2047/025 (2013.01 - EP US)
Designated contracting state (EPC)
AT CH DE FR GB IT LI
DOCDB simple family (publication)
DE 19653105 C1 19980423; EP 0849755 A2 19980624; EP 0849755 A3 19981223; JP H10188766 A 19980721; US 5896075 A 19990420
DOCDB simple family (application)
DE 19653105 A 19961219; EP 97120100 A 19971117; JP 34635097 A 19971216; US 99322597 A 19971218