EP 0849770 A2 19980624 - Manufacturing procedure of helicoidally wound coiled filaments and coiled filaments manufactured using said procedure
Title (en)
Manufacturing procedure of helicoidally wound coiled filaments and coiled filaments manufactured using said procedure
Title (de)
Verfahren zur Herstellung von helikal gewickelten Wendelkörpern und Wendelkörper, die nach dieser Methode hergestellt sind
Title (fr)
Procédé de fabrication de filaments à enroulement hélicoidal et filament obtenu par ledit procédé
Publication
Application
Priority
- CA 2233854 A 19980402
- DE 19653572 A 19961220
Abstract (en)
The production of a helically wound body, especially an incandescent element, comprises heat treating a high melting material wire (3) in the region of its recrystallisation temperature and then immediately winding the wire (3) on a core (1). Preferably, the wire (3) is a tungsten wire and is heat treated by an argon/nitrogen or argon/helium plasma torch (4) at just below, preferably 60-90% of, the recrystallisation temperature. Also claimed are: (i) a coil, especially an incandescent element, or electrode produced by the above process; and (ii) a lamp equipped with the above coil or electrode.
Abstract (de)
Das Verfahren zeichnet sich dadurch aus, daß eine thermische Behandlung des Glühdrahts bei Temperaturen von mehr als 1200 °C bereits vor dem Wickeln des Glühdrahts stattfindet, so daß das Gewendel nach dem Vereinzeln aufspringt und sich leicht vom Kerndraht lösen läßt. <IMAGE>
IPC 1-7
IPC 8 full level
H01J 9/04 (2006.01); H01J 9/02 (2006.01); H01K 1/02 (2006.01); H01K 3/02 (2006.01)
CPC (source: EP US)
B21F 35/006 (2013.01 - EP US); H01K 1/02 (2013.01 - EP US); H01K 3/02 (2013.01 - EP US)
Designated contracting state (EPC)
BE DE FR GB IT NL
DOCDB simple family (publication)
EP 0849770 A2 19980624; EP 0849770 A3 19990609; EP 0849770 B1 20031008; CA 2233854 A1 19991002; CN 1118861 C 20030820; CN 1185650 A 19980624; DE 19653572 A1 19980625; DE 59710832 D1 20031113; JP H10188918 A 19980721; US 6161598 A 20001219
DOCDB simple family (application)
EP 97121787 A 19971210; CA 2233854 A 19980402; CN 97125574 A 19971219; DE 19653572 A 19961220; DE 59710832 T 19971210; JP 36400697 A 19971217; US 5270198 A 19980331