Global Patent Index - EP 0850173 A1

EP 0850173 A1 19980701 - PACKAGING, CUT-OUT AND RELATED MANUFACTURING PROCESS

Title (en)

PACKAGING, CUT-OUT AND RELATED MANUFACTURING PROCESS

Title (de)

VERPACKUNG, ZUSCHNITT DAFÜR UND VERFAHREN ZU IHRER HERSTELLUNG

Title (fr)

EMBALLAGE, DECOUPE ET PROCEDE DE FABRICATION ASSOCIE

Publication

EP 0850173 A1 19980701 (DE)

Application

EP 96931015 A 19960904

Priority

  • DE 19532454 A 19950904
  • EP 9603878 W 19960904

Abstract (en)

[origin: DE19532454A1] A method for the production of a form of packaging especially for gifts, advertising items and CDs comprising a cut-out of paperboard or some other flexible springy material that is cut on the flat with a base segment (115) side segments (119, 120, 121) and/or flaps (125, 126, 127) and which has cut or stamped into it slits (122, 123, 124) and parallel folds (116, 117, 118) and/or fold lines (128, 129, 130) where one slit is cut into each side segment parallel to neither the parallel fold nor the fold line in that segment. The cut-out is folded along the parallel and/or stamped fold lines and the tip of each flap in turn is inserted into the slit in the following side segment from outside. The resulting, folded cut-out then forms a stable and rigid package without the need for adhesives.

IPC 1-7

B65D 5/00; B65D 75/14

IPC 8 full level

B65D 5/00 (2006.01); B65D 5/20 (2006.01); B65D 75/14 (2006.01)

CPC (source: EP)

B65D 5/008 (2013.01); B65D 5/2028 (2013.01); B65D 5/2042 (2013.01); B65D 75/14 (2013.01)

Citation (search report)

See references of WO 9709237A1

Designated contracting state (EPC)

AT BE CH DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE

DOCDB simple family (publication)

DE 19532454 A1 19970306; DE 19532454 C2 19990128; EP 0850173 A1 19980701; WO 9709237 A1 19970313

DOCDB simple family (application)

DE 19532454 A 19950904; EP 9603878 W 19960904; EP 96931015 A 19960904