EP 0853817 A1 19980722 - ELECTRONIC PACKAGE WITH ENHANCED PAD DESIGN
Title (en)
ELECTRONIC PACKAGE WITH ENHANCED PAD DESIGN
Title (de)
ELEKTRONISCHE PACKUNG MIT VERBESSERTEM MUSTER FÜR DIE ANSCHLUSSFLÄCHE
Title (fr)
MODULE ELECTRONIQUE A CONCEPTION AVANCEE DE PLAGES DE CONNEXION
Publication
Application
Priority
- GB 9602420 W 19961003
- IT 9500161 W 19951004
Abstract (en)
[origin: WO9713275A1] An electronic package (400), particularly a BGA, including a circuitized substrate (120) and one or more active devices (110) attached thereon by means of corresponding conductive pads provided on a surface of the substrate (120); each conductive pad is splitted in a plurality of parts (212-218) not in contact. Such parts (212-218) may be separated by a wireable area of the substrate (120), thereby providing one or more wiring channels. In addition, the same parts (212-218) may be connected in interfacing couples at different electrical potentials (ground and power) and decoupled to each other by means of capacitors (410); the connections to the ground and power are achieved by metallized holes provided through the substrate (120).
IPC 1-7
IPC 8 full level
H01L 23/12 (2006.01); H01L 23/31 (2006.01); H01L 23/498 (2006.01); H01L 23/64 (2006.01)
CPC (source: EP KR)
H01L 23/3128 (2013.01 - EP); H01L 23/498 (2013.01 - KR); H01L 23/49822 (2013.01 - EP); H01L 23/642 (2013.01 - EP); H01L 24/32 (2013.01 - EP); H01L 24/48 (2013.01 - EP); H01L 24/73 (2013.01 - EP); H01L 2224/29111 (2013.01 - EP); H01L 2224/32057 (2013.01 - EP); H01L 2224/32225 (2013.01 - EP); H01L 2224/48091 (2013.01 - EP); H01L 2224/48227 (2013.01 - EP); H01L 2224/73265 (2013.01 - EP); H01L 2224/83385 (2013.01 - EP); H01L 2924/0001 (2013.01 - EP); H01L 2924/00014 (2013.01 - EP); H01L 2924/01005 (2013.01 - EP); H01L 2924/01006 (2013.01 - EP); H01L 2924/01013 (2013.01 - EP); H01L 2924/01029 (2013.01 - EP); H01L 2924/01032 (2013.01 - EP); H01L 2924/01033 (2013.01 - EP); H01L 2924/01039 (2013.01 - EP); H01L 2924/01047 (2013.01 - EP); H01L 2924/0105 (2013.01 - EP); H01L 2924/01052 (2013.01 - EP); H01L 2924/01061 (2013.01 - EP); H01L 2924/01074 (2013.01 - EP); H01L 2924/01077 (2013.01 - EP); H01L 2924/01079 (2013.01 - EP); H01L 2924/01082 (2013.01 - EP); H01L 2924/0132 (2013.01 - EP); H01L 2924/01322 (2013.01 - EP); H01L 2924/09701 (2013.01 - EP); H01L 2924/1517 (2013.01 - EP); H01L 2924/15311 (2013.01 - EP); H01L 2924/16152 (2013.01 - EP); H01L 2924/181 (2013.01 - EP); H01L 2924/19041 (2013.01 - EP); H01L 2924/19105 (2013.01 - EP)
Citation (search report)
See references of WO 9713275A1
Designated contracting state (EPC)
DE GB IE
DOCDB simple family (publication)
WO 9713275 A1 19970410; EP 0853817 A1 19980722; JP 3093278 B2 20001003; JP H11508409 A 19990721; KR 100276858 B1 20010115; KR 19990064001 A 19990726; TW 299564 B 19970301
DOCDB simple family (application)
GB 9602420 W 19961003; EP 96932706 A 19961003; JP 51407297 A 19961003; KR 19980702478 A 19980403; TW 85105592 A 19960511