Global Patent Index - EP 0853919 A3

EP 0853919 A3 20010509 - A high resolution intravascular ultrasound transducer assembly having a flexible substrate and method for manufacture thereof

Title (en)

A high resolution intravascular ultrasound transducer assembly having a flexible substrate and method for manufacture thereof

Title (de)

Hochauflösende intravaskuläre Ultraschalltransducervorrichtung mit einem flexiblen Substrat und Methode zu seiner Herstellung

Title (fr)

Transducteur ultrasonique de haute résolution avec un substrat flexible et méthode pour sa fabrication

Publication

EP 0853919 A3 20010509 (EN)

Application

EP 98200020 A 19980107

Priority

US 78043797 A 19970108

Abstract (en)

[origin: EP0853919A2] An ultrasound transducer assembly of the present invention includes a flexible circuit to which an ultrasound transducer array and integrated circuitry are attached during fabrication of the ultrasound transducer assembly. Integrated circuitry and transducer elements are attached to the flexible circuit while the flexible circuit is in a substantially flat shape. The contacts of the transducer elements are positioned on substantially the same plane such that electrical contact with signal and ground lines on the flexible circuit is established without the need for conductive bridges to physically remote electrodes. In an embodiment of the invention wherein the transducer elements are arranged in a cylindrical array, gaps are entirely filled with backing material having a relatively low acoustic impedance. Structure integrity is enhanced and a path to ground facilitated by electrically conductive disks attached to the ends of the transducer assembly.

IPC 1-7

B06B 1/06

IPC 8 full level

A61B 8/12 (2006.01); B06B 1/06 (2006.01); H04R 17/00 (2006.01); H05K 1/18 (2006.01)

CPC (source: EP US)

A61B 1/0011 (2013.01 - EP US); A61B 8/12 (2013.01 - EP US); A61B 8/4488 (2013.01 - EP US); B06B 1/0622 (2013.01 - EP US); B06B 1/0633 (2013.01 - EP US); A61B 8/445 (2013.01 - EP US); H05K 1/189 (2013.01 - EP US); Y10T 29/42 (2015.01 - EP US); Y10T 29/49005 (2015.01 - EP US); Y10T 29/4913 (2015.01 - EP US)

Citation (search report)

Designated contracting state (EPC)

AT BE CH DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE

DOCDB simple family (publication)

EP 0853919 A2 19980722; EP 0853919 A3 20010509; EP 0853919 B1 20111228; AT E538879 T1 20120115; CA 2226194 A1 19980708; JP H10192281 A 19980728; US 2004054289 A1 20040318; US 2005197574 A1 20050908; US 5857974 A 19990112; US 6049958 A 20000418; US 6618916 B1 20030916; US 6899682 B2 20050531

DOCDB simple family (application)

EP 98200020 A 19980107; AT 98200020 T 19980107; CA 2226194 A 19971231; JP 257798 A 19980108; US 12025705 A 20050502; US 55086400 A 20000417; US 66126903 A 20030912; US 78043797 A 19970108; US 97467797 A 19971119