EP 0853995 B1 20011121 - Injection moulding composition containing metal oxide for making metal shapes

Title (en)

Injection moulding composition containing metal oxide for making metal shapes

Title (de)

Metalloxide enthaltende Spritzgiessmassen zur Herstellung von Metallformkörpern

Title (fr)

Masse à moulage d'injection en contenant des oxides métalliques pour la fabrication d'objets en métaux

Publication

EP 0853995 B1 20011121 (DE)

Application

EP 98100066 A 19980105

Priority

DE 19700277 A 19970107

Abstract (en)

[origin: US6080808A] The molding composition contains, in a flowable binder, from 20 to 50% by vol., based on the total volume of the molding composition, of a powder comprising one or more metal oxides and, if desired, metal carbides and/or metal nitrides which cannot be reduced using hydrogen, where at least 65% by vol. of the powder has a maximum particle size of 0.5 mu m and the remainder of the powder has a maximum particle size of 1 mu m, and at least 90% by vol. of the powder comprises metal oxides which can be reduced using hydrogen. The metal oxides which can be reduced using hydrogen are Fe2O3, FeO, Fe3O4, NiO, CoO, Co3O4, CuO, Cu2O, Ag2O, Bi2O3, WO3, MoO3, SnO, SnO2, CdO, PbO, Pb3O4, PbO2 or Cr2O3, or mixtures thereof.

IPC 1-7

B22F 3/11; C22C 1/04; C22C 1/05; C04B 35/638; C04B 35/65

IPC 8 full level

C04B 35/00 (2006.01); B22F 3/00 (2006.01); B22F 3/02 (2006.01); B22F 3/11 (2006.01); B22F 3/22 (2006.01); C04B 35/638 (2006.01); C04B 35/65 (2006.01); C22C 1/04 (2006.01); C22C 1/05 (2006.01)

CPC (source: EP KR US)

B22F 3/001 (2013.01 - EP KR US); B22F 3/22 (2013.01 - EP US); B22F 3/225 (2013.01 - EP KR US); B22F 2998/00 (2013.01 - EP US); B22F 2998/10 (2013.01 - EP KR US); B22F 2999/00 (2013.01 - EP KR US)

C-Set (source: EP US)

B22F 2998/00 + B22F 3/225
B22F 2998/10 + B22F 3/1021 + B22F 3/1007
B22F 2999/00 + B22F 3/1007 + B22F 2201/013

Designated contracting state (EPC)

AT BE CH DE ES FR GB IT LI NL

DOCDB simple family (publication)

US 6080808 A 20000627; AT E209076 T1 20011215; DE 19700277 A1 19980709; DE 59802182 D1 20020103; EP 0853995 A1 19980722; EP 0853995 B1 20011121; ES 2168690 T3 20020616; JP H10298606 A 19981110; KR 100516081 B1 20051206; KR 19980070378 A 19981026; TW 495532 B 20020721

DOCDB simple family (application)

US 283398 A 19980105; AT 98100066 T 19980105; DE 19700277 A 19970107; DE 59802182 T 19980105; EP 98100066 A 19980105; ES 98100066 T 19980105; JP 157098 A 19980107; KR 19980000178 A 19980107; TW 87100140 A 19980107